RF amplifier module and methods of manufacture thereof

ABSTRACT

An amplifier module includes a module substrate. Conductive interconnect structures and an amplifier device are coupled to a top surface of the module substrate. The interconnect structures partially cover the module substrate top surface to define conductor-less areas at the top surface. The amplifier device includes a semiconductor substrate, a transistor, a conductive feature coupled to a bottom surface of the semiconductor substrate and to at least one of the interconnect structures, and a filter circuit electrically coupled to the transistor. The conductive feature only partially covers the semiconductor substrate bottom surface to define a conductor-less region that spans a portion of the bottom surface. The conductor-less region is aligned with at least one of the conductor-less areas at the module substrate top surface. The filter circuit includes a passive component formed over a portion of the semiconductor substrate top surface that is directly opposite the conductor-less region.

RELATED APPLICATION

This application is a continuation-in-part of co-pending U.S. patentapplication Ser. No. 14/666,999, filed on Mar. 24, 2015.

TECHNICAL FIELD

Embodiments of the subject matter described herein relate generally toradio frequency (RF) amplifiers, and more particularly to RF amplifiersthat include impedance matching circuits.

BACKGROUND

A typical high power, radio frequency (RF) semiconductor device mayinclude one or more input leads, one or more output leads, one or moretransistors, wirebond arrays coupling the input lead(s) to thetransistor(s), and wirebond arrays coupling the transistor(s) to theoutput lead(s). The wirebond arrays have significant inductances at highfrequencies, and such inductances may be factored into the design ofinput and output circuits for a device (e.g., impedance matchingcircuits).

In some cases, input and output circuits may be contained within thesame package that contains the device's transistor(s). Morespecifically, an in-package, input impedance matching circuit may becoupled between a device's input lead and a control terminal (e.g., thegate) of a transistor, and an in-package, output impedance matchingcircuit may be coupled between a current conducting terminal (e.g., thedrain) of a transistor and a device's output lead. Each of the input andoutput circuits may include one or more capacitive elements, along withthe inductances inherent in the wirebond arrays interconnecting thecapacitive elements with the device's transistor(s) and with the inputand output leads.

Wirebond arrays may be designed to function as inductors with relativelyhigh Q (quality) factors, which is desirable to achieve high efficiencyamplifiers. However, wirebond arrays often lead to undesirable inductivecoupling between various device components. Further, the inclusion ofsuch wirebond arrays in RF devices mandates the use of relativelycomplex back-end assembly processes using expensive equipment that isnot commonly used in the semiconductor industry. For example, thewirebond array attachment equipment must be configured to accuratelyshape and space each wirebond in order to achieve desired inductances.The inductive coupling characteristics and back-end assembly costsassociated with the inclusion of wirebond arrays in RF amplifier devicesdetrimentally affects device performance and cost.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the subject matter may be derived byreferring to the detailed description and claims when considered inconjunction with the following figures, wherein like reference numbersrefer to similar elements throughout the figures.

FIG. 1 is a schematic diagram of an RF amplifier with input and outputcircuits, in accordance with an example embodiment;

FIG. 2 is a schematic diagram of an RF amplifier with input and outputcircuits, in accordance with another example embodiment;

FIG. 3 is a schematic diagram of an RF amplifier with input and outputcircuits, in accordance with yet another example embodiment;

FIG. 4 is a top view of a portion of a semiconductor die, which includesportions of two amplifier paths, in accordance with an exampleembodiment, in accordance with an example embodiment;

FIG. 5 is a bottom view of the die of FIG. 4, in accordance with anembodiment;

FIG. 6 is a cross-sectional, side view of the die of FIG. 4 along line6-6;

FIG. 7 is a cross-sectional, side view of an embodiment of asemiconductor die with wrap-around terminations, in accordance with anembodiment;

FIG. 8 is a cross-sectional, side view of the die of FIG. 4 along line8-8;

FIG. 9 is a cross-sectional, side view of the die of FIG. 4 along line9-9;

FIG. 10 is an enlarged, top view of the die of FIG. 4 in area 10;

FIG. 11 is a flowchart of a method of manufacturing and packaging anamplifier, and incorporating the amplifier into an amplifier system, inaccordance with an example embodiment;

FIGS. 12-16 illustrate various views of an amplifier in the process ofmanufacturing and packaging the amplifier, and incorporating theamplifier into an amplifier system, in accordance with an exampleembodiment;

FIG. 17 is a chart illustrating inductor quality (Q) factor with respectto frequency for a conventional inductor and an inductor implementedaccording to an embodiment;

FIG. 18 is a block diagram of a Doherty power amplifier, in accordancewith an embodiment;

FIG. 19 is a block diagram of an amplifier system, in accordance with anembodiment;

FIG. 20 is a flowchart of a method of manufacturing an amplifier modulethat includes an amplifier system, in accordance with an exampleembodiment; and

FIGS. 21-26 illustrate various views of an amplifier module in theprocess of manufacturing the amplifier module, in accordance with anexample embodiment.

DETAILED DESCRIPTION

Embodiments of the inventive subject matter include amplifiers withhigh-Q impedance matching circuit inductors that are not implementedusing wirebond arrays. Further, embodiments of the inventive subjectmatter include amplifiers implemented on semiconductor substrates withpatterned back metal, where physically separated portions of the backmetal may provide distinct input, output, and ground ports, among otherthings. As will be illuminated below, the various embodiments may enablea significant reduction or complete elimination of wirebond arrays in anRF amplifier device while achieving high efficiency. This may lead tosignificantly reduced manufacturing costs and higher levels ofintegration than are achievable using conventional RF amplifier designsand fabrication techniques.

FIG. 1 is a schematic diagram of an RF amplifier device 100. Device 100includes an input terminal 102, an output terminal 104, one or morevoltage reference terminals 106 (only one of which is shown in FIG. 1),a radio frequency (RF) cold point terminal 108, an input circuit 110, atransistor 120, and an output circuit 130, in an embodiment. Althoughtransistor 120 and various elements of the input and output circuits110, 130 are shown as singular components, the depiction is for thepurpose of ease of explanation only. Those of skill in the art wouldunderstand, based on the description herein, that transistor 120 and/orcertain elements of the input and output circuits 110, 130 each may beimplemented as multiple components (e.g., connected in parallel or inseries with each other). The description of transistor 120 and variouselements of the input and output circuits 110, 130, below, are notintended to limit the scope of the inventive subject matter only to theillustrated embodiments.

Transistor 120 is the primary active component of device 100. Transistor120 includes a control terminal and first and second current conductingterminals, where the current conducting terminals are spatially andelectrically separated by a variable-conductivity channel. For example,transistor 120 may be a field effect transistor (FET) (such as a metaloxide semiconductor FET (MOSFET), a laterally diffused MOSFET (LDMOSFET), a high electron mobility transistor (HEMT), and so on), whichincludes a gate (control terminal), a source (a first current conductingterminal), and a drain (a second current conducting terminal).Alternatively, transistor 120 may be a bipolar junction transistor(BJT). Accordingly, references herein to a “gate,” “drain,” and“source,” are not intended to be limiting, as each of these designationshas analogous features for a BJT implementation (e.g., a base,collector, and emitter, respectively).

According to an embodiment, and using nomenclature typically applied toMOSFETs in a non-limiting manner, the gate of transistor 120 is coupledthrough the input circuit 110 to the input terminal 102, the drain oftransistor 120 is coupled through the output circuit 130 to the outputterminal 104, and the source of transistor 120 is coupled through thevoltage reference terminal 106 to ground (or another voltage reference).More specifically, the gate of transistor 120 may be coupled to theinput terminal 102 through one or more conductive structures 160 (e.g.,conductive vias or other structures), the source of transistor 120 maybe coupled to voltage reference terminal 106 (e.g., a terminal coupledto ground or another voltage reference) through one or more otherconductive structures 164 (e.g., conductive vias, a heavily doped sinkerregion, and so on), and the drain of transistor 120 may be coupled tooutput terminal 104 through one or more other conductive structures 170(e.g., conductive vias or other structures). According to an embodiment,a DC blocking capacitor 136 may be coupled between the drain oftransistor 120 and the output terminal 104, as illustrated, or the DCblocking capacitor 136 may be excluded, in other embodiments. The valueof the DC blocking capacitor 136 may be selected to provide significantgain reductions at low frequencies (e.g., frequencies below the intendedRF operating band).

Through the variation of control signals (e.g., input RF signals)provided to the gate of transistor 120, the current between the currentconducting terminals of transistor 120 is modulated. For example, whenincorporated into an amplifier system (e.g., Doherty amplifier system1800, FIG. 18), input terminal 102 functions to receive a relativelylow-power, input RF signal for amplification. The input RF signalreceived through input terminal 102 is amplified through transistor 120,and the resultant amplified RF signal is output through output terminal104.

The input RF signal is conveyed from the input terminal 102 through theinput circuit 110 to the control terminal of transistor 120. Inputcircuit 110, which functions to filter the input RF signal, is coupledbetween the input terminal 102 and the control terminal of transistor120. According to an embodiment, input circuit 110 is an input impedancematching circuit, which is configured to raise the impedance of device100 to a higher (e.g., intermediate or higher) impedance level (e.g., ina range from about 2 to about 10 Ohms or higher). Input circuit 110 iscoupled to the input terminal 102 through the conductive structure(s)160. Further, input circuit 110 may be coupled through one or moreadditional conductive structures 162 to voltage reference terminal 106(or another distinct voltage reference terminal).

According to an embodiment, input circuit 110 includes an inductiveelement 116 and a shunt capacitor 114. More specifically, a first plate(or terminal) of shunt capacitor 114 is electrically coupled to theinput terminal 102 (e.g., through conductive structure(s) 160), and asecond plate (or terminal) of shunt capacitor 114 is electricallycoupled to the voltage reference terminal 106 (e.g., through conductivestructure(s) 162). Inductive element 116 has a first terminal that alsois electrically coupled to the input terminal 102 (e.g., throughconductive structure(s) 160) and to the first plate of shunt capacitor114, and a second terminal that is electrically coupled to the controlterminal of transistor 120. According to an embodiment, the inductiveelement 116 may have a value in a range between about 50 picohenries(pH) to about 3 nanohenries (nH), and shunt capacitor 114 may have avalue in a range between about 5 picofarads (pF) to about 80 pF,although inductive element 116 and shunt capacitor 114 may have valuesthat fall outside of these ranges, as well. In this configuration, inputcircuit 110 operates as a low pass filter circuit. In alternateembodiments, input circuit 110 may be configured as a high pass filtercircuit (e.g., as in the embodiment of FIG. 2) or as a bandpass filtercircuit (e.g., as in the embodiment of FIG. 3).

Output circuit 130, which functions to filter the amplified RF signal,is coupled between the drain terminal of transistor 120 and the outputterminal 104. According to an embodiment, output circuit 130 is anoutput impedance matching circuit, which is configured to match theoutput impedance of device 100 with the input impedance of an externalcircuit or component (not shown) that may be coupled to output terminal104 (e.g., 50 Ohms or some other value). Output circuit 130 is coupledto the drain of transistor 120 and to output terminal 104 through one ormore conductive structures 170 (e.g., conductive vias or otherstructures). In addition, output circuit 130 may be coupled through oneor more additional conductive structures 166 to voltage referenceterminal 106 (or another distinct voltage reference terminal). Further,according to an embodiment, output circuit 130 also may be coupledthrough one or more additional conductive structures 168 and RF coldpoint terminal 108 to other external circuitry (described below).

According to an embodiment, output circuit 130 includes a shuntinductive element 134 and a shunt capacitor 132 coupled in series. Morespecifically, inductive element 134 has a first terminal that iselectrically coupled to the drain of transistor 120, and also to outputterminal 104 (e.g., through conductive structure(s) 170). Inductiveelement 134 has a second terminal that is coupled to a first plate (orterminal) of shunt capacitor 132. A second plate (or terminal) of shuntcapacitor 132 is electrically coupled to the voltage reference terminal106 (or another distinct voltage reference terminal) through conductivestructure(s) 166. According to an embodiment shunt inductor 134 may havea value in a range between about 100 pH to about 3 nH, and shuntcapacitor 132 may have a value in a range between about 50 pF to about500 pF, although these components may have values outside of theseranges, as well. In this configuration, output circuit 130 operates as ahigh pass filter circuit. In alternate embodiments, output circuit 130may be configured as a low pass filter circuit (e.g., as in theembodiment of FIG. 2) or as a bandpass filter circuit (e.g., as in theembodiment of FIG. 3). In an exemplary embodiment, the output circuitry130 provides a single phase inversion (e.g., a 90° phase shift) thatresults in the phase of the signal at the output terminal 104 beingshifted 90° relative to the signal at the drain of transistor 120.

In an exemplary embodiment, an RF “cold point” is present at the node142 between shunt inductor 134 and shunt capacitor 132. Accordingly,node 142 may be referred to herein as an “RF cold point node.” Morespecifically, the capacitance of the shunt capacitor 132 is chosen toprovide a virtual ground reference voltage for the RF electrical signalsat node 142, such that inductive element 134 functions as a shuntinductance to the RF ground voltage, while the inductance of theinductive element 134 is chosen to provide desired impedance at theoutput terminal 104 at the fundamental frequency of the amplifier 100.For example, for a fundamental frequency in the range of about 1.8gigahertz (GHz) to about 2.2 GHz with a transistor 120 with a powerhandling capability within the range of about 50 watts (W) to about 500W, the capacitance of capacitor 132 may be chosen to be within the rangeof about 70 pF to about 500 pF, the inductance of the inductive element124 may be chosen to be within the range of about 100 pH to about 500pH, such that the output circuit 130 provides an output impedance at theoutput terminal 104 within the range of about 1.0 to 5.0 Ohms. It shouldbe appreciated that the desired output impedance at the output terminal104 may be an intermediate impedance that is subsequently transformed toa different value for impedance matching at the input of a powercombiner (e.g., power combiner 1860, FIG. 18), and thus, the outputimpedance at the output terminal 104 will vary to suit the needs of aparticular implementation.

Through one or more additional conductive structures 168 (e.g.,conductive vias) and RF cold point node terminal 108, the RF cold pointnode 142 may be coupled to an external circuit. For example, theexternal circuit may include a voltage source, Vdd, and an envelopefrequency termination circuit 140. The voltage source Vdd may be used tobias the transistor 120, and the envelope frequency termination circuit140 may function to improve the low frequency resonance of device 100caused by the interaction between the output circuit 130 and bias feeds(not shown) by presenting a high impedance at RF frequencies. In anembodiment in which DC blocking capacitor 136 is excluded, Vddalternatively may be provided at output terminal 104. The envelopefrequency termination circuit 140 essentially is “invisible” from amatching standpoint, as it only effects the output impedance at envelopefrequencies (i.e., envelope frequency termination circuit 140 providesterminations for the envelope frequencies of device 100).

According to an embodiment, envelope frequency termination circuit 140includes a capacitor 146, which may be referred to herein as an“envelope capacitor.” A first plate (or terminal) of envelope capacitor146 is coupled to RF cold point terminal 108, and a second plate (orterminal) of the envelope capacitor 146 is coupled to ground (or anothervoltage reference), in an embodiment. Envelope capacitor 146 may be adiscrete component, for example, and may have a value in a range betweenabout 2.0 nanofarads (nF) to about 1.0 microfarad (μF), althoughenvelope capacitor 146 may have a value outside of this range, as well.According to an embodiment, envelope capacitor 146 may be coupledthrough relatively low-inductance connections to a printed circuit board(PCB) to which device 100 is coupled.

According to an embodiment, input circuit 110, transistor 120, andoutput circuit 130 all are implemented on a single semiconductor die(e.g., die 450, FIG. 4). In other words, the RF amplifier device 100 ismonolithic. In alternate embodiments, portions of input circuit 110and/or output circuit 130 may be implemented as discrete components,and/or may be implemented on semiconductor die that are distinct fromthe semiconductor die on which transistor 120 is implemented. Althoughthe Figures and description focus on a monolithic implementation, thoseof skill in the art would understand, based on the description herein,how various modifications may be made for a non-monolithicimplementation (i.e., an implementation in which some components of theinput and/or output circuits are included on die other than thetransistor die).

According to an embodiment in which input circuit 110, transistor 120,and output circuit 130 are implemented on a single semiconductorsubstrate, these circuit components may be formed in proximity to (e.g.,below, at, and above) a top surface of the substrate. Conversely, someor all of input terminal 102, output terminal 104, voltage referenceterminal 106, and RF cold point terminal 108 each may include aconductive feature coupled to a bottom surface of the semiconductorsubstrate, in an embodiment. When coupled to the bottom semiconductorsubstrate surface, terminals 102, 104, 106, 108 are physically separatedfrom each other across “conductor-less” regions of the bottomsemiconductor substrate surface (i.e., portions of the bottomsemiconductor substrate surface to which no conductive material iscoupled). In any event, terminals 102, 104, 106, 108 enable the RFamplifier device 100 to be electrically coupled with external circuitry.

For example, the RF amplifier device 100 may be physically andelectrically coupled to a PCB or other substrate (e.g., PCB 1610, FIG.16), which includes additional circuitry of the amplifier system. Inthis configuration, a device plane (represented by dashed line 150) isestablished, where amplifier components present on one side of thedevice plane (e.g., components above line 150 in FIG. 1, or “above thedevice plane”) may be implemented on a single semiconductor substrate,and components present on the other side of the device plane (e.g.,components below line 150 in FIG. 1, or “below the device plane”) may becoupled to the PCB or other substrates. For example, and as will bedescribed in more detail later, ground references, voltage references(e.g., Vdd), other components (e.g., capacitor 146), transmission lines,signal splitters, signal combiners, phase shifters, and various otheramplifier components may be implemented below the device plane.

In the embodiment illustrated in FIG. 1, input circuit 110 is configuredas a low pass filter, and output circuit 130 is configured as a highpass filter. As mentioned above, in an alternate embodiment of anamplifier 200, such as is illustrated in FIG. 2, input circuit 210 maybe configured as a high pass filter, and/or output circuit 230 may beconfigured as a low pass filter. For example, a high pass filter inputcircuit 210 may include a shunt inductive element 216 and a shuntcapacitor 214 coupled in series. More specifically, inductive element216 has a first terminal that is electrically coupled to the gate oftransistor 120, and also to input terminal 102 (e.g., through conductivestructure(s) 160). Inductive element 216 has a second terminal that iscoupled to a first plate (or terminal) of shunt capacitor 214. A secondplate (or terminal) of shunt capacitor 214 is electrically coupled tothe voltage reference terminal 106 (or another distinct voltagereference terminal) through conductive structure(s) 162.

A low pass filter output circuit 230 may include an inductive element234 and a shunt capacitor 232. More specifically, a first terminal ofinductive element 234 is electrically coupled to the drain of transistor120, and a second terminal of inductive element 234 is electricallycoupled to the output terminal 104 (e.g., through conductivestructure(s) 170) and to a first plate (or terminal) of shunt capacitor232. According to an embodiment, a DC blocking capacitor 136 may becoupled between the second terminal of inductive element 234 and theoutput terminal 104, as illustrated, or the DC blocking capacitor 136may be excluded, in other embodiments. The first plate of shuntcapacitor 232 also is electrically coupled to the output terminal 104(e.g., through conductive structure(s) 170 and DC blocking capacitor136, when included), and a second plate (or terminal) of shunt capacitor232 is electrically coupled to the voltage reference terminal 106 (e.g.,through conductive structure(s) 166).

In an exemplary embodiment, an RF low impedance node 242 is presentbetween inductor 234 and DC blocking capacitor 236, when included.Through one or more additional conductive structures 168 (e.g.,conductive vias) and terminal 108, node 242 may be coupled to anexternal circuit (e.g., including a voltage source, Vdd, and an envelopefrequency termination circuit 140). To avoid directly coupling Vdd to RFlow impedance node 242, high impedance element 244 is provided betweenVdd and node 242, in an embodiment. The high impedance element 244 maybe implemented, for example, as a quarter wave line or an inductiveelement. Although FIG. 2 shows high impedance element 244 implementedbelow the device plane 150 (e.g., on a PCB to which the device iscoupled), high impedance element 244 may be implemented above the deviceplane 150 (e.g., coupled to or monolithically formed as part of thesemiconductor substrate), in another embodiment. In an embodiment inwhich DC blocking capacitor 136 is excluded, terminals 104 and 108 maybe replaced with a single terminal for outputting the amplified outputsignal, and Vdd, high impedance element 244, and/or envelope frequencytermination circuit 140 may be provided at that terminal.

As also mentioned above, in another alternate embodiment, either or bothof the input circuit and/or output circuit may be configured as abandpass filter. For example, in the embodiment of an amplifier 300illustrated in FIG. 3, both input circuit 310 and output circuit 330 areconfigured as bandpass filters. More specifically, bandpass filter inputcircuit 310 includes a low pass filter section and a high pass filtersection. The low pass filter section includes an inductive element 316and a shunt capacitor 314, and the high pass filter section includes ashunt inductive element 317 and a shunt capacitor 315 coupled in series.More specifically, shunt capacitor 314 has a first plate (or terminal)coupled to input terminal 102 (e.g., through conductive structure(s)160), and a second plate (or terminal), which is electrically coupled tothe voltage reference terminal 106 (or another distinct voltagereference terminal) through conductive structure(s) 162. Inductiveelement 316 has a first terminal that is electrically coupled to theinput terminal 102 (e.g., through conductive structure(s) 160), and asecond terminal that is electrically coupled to the gate of transistor120. According to an embodiment, a DC blocking capacitor 312 may becoupled between the first terminal of inductive element 316 and theinput terminal 102, as illustrated, or the DC blocking capacitor 312 maybe excluded, in other embodiments. Inductive element 317 has a firstterminal that is coupled to the second terminal of inductive element316, and also to the gate of transistor 120. In addition, inductiveelement 317 has a second terminal that is coupled to a first plate (orterminal) of shunt capacitor 315. A second plate (or terminal) of shuntcapacitor 315 is electrically coupled to the voltage reference terminal106 (or another distinct voltage reference terminal) through conductivestructure(s) 162.

In an exemplary embodiment, an RF cold point node 318 is present betweeninductor 317 and shunt capacitor 315. Through one or more additionalconductive structures 362 (e.g., conductive vias) and RF cold point nodeterminal 302, the RF cold point node 318 may be coupled to an externalcircuit (e.g., including a voltage source, Vgg, and an envelopefrequency termination circuit 340).

Bandpass filter out circuit 330 also includes a high pass filter sectionand a low pass filter section. The high pass filter section includes ashunt inductive element 334 and a shunt capacitor 332 coupled in series,and the low pass filter section includes an inductive element 335 and ashunt capacitor 333. More specifically, inductive element 334 has afirst terminal that is coupled to the drain of transistor 120, and alsoto a first terminal of inductive element 335. In addition, inductiveelement 334 has a second terminal that is coupled to a first plate (orterminal) of shunt capacitor 332. A second plate (or terminal) of shuntcapacitor 332 is electrically coupled to the voltage reference terminal106 (or another distinct voltage reference terminal) through conductivestructure(s) 166. Inductive element 335 has a first terminal that iselectrically coupled to the drain of transistor 120 and to the firstterminal of inductive element 334, and a second terminal that is coupledto the output terminal 104 (e.g., through conductive structure(s) 170).According to an embodiment, a DC blocking capacitor 136 may be coupledbetween the second terminal of inductive element 335 and the outputterminal 104, as illustrated, or the DC blocking capacitor 136 may beexcluded, in other embodiments. The second terminal of inductive element335 also is coupled to a first plate (or terminal) of shunt capacitor333. A second plate (or terminal) of shunt capacitor 333 is electricallycoupled to the voltage reference terminal 106 (or another distinctvoltage reference terminal) through conductive structure(s) 166.

In an exemplary embodiment, an RF cold point node 342 is present betweeninductor 334 and shunt capacitor 332. Through one or more additionalconductive structures 168 (e.g., conductive vias) and RF cold point nodeterminal 108, the RF cold point node 342 may be coupled to an externalcircuit (e.g., including a voltage source, Vdd, and an envelopefrequency termination circuit 140).

Embodiments of integrated circuit implementations of the amplifier ofFIG. 1 will now be described. FIGS. 4 and 5, which should be viewedtogether for increased understanding, are top and bottom views,respectively, of a semiconductor die 450, which includes portions of twoamplifier paths 400, 401, in accordance with an example embodiment.FIGS. 6-10 also will be referenced in the description of semiconductordie 450, as those figures illustrate various cross-sectional or enlargedviews of portions of die 450, and those views are helpful inunderstanding the various details of the embodiments. More specifically,FIGS. 6, 8, and 9 are cross-sectional, side views of die 450 along lines6-6, 8-8, and 9-9, respectively, in FIG. 4, and FIG. 7 is an alternativeembodiment of a cross-sectional, side view of a die along a line thatwould correspond to line 6-6 in FIG. 4. It should be noted that thecross-sectional views in FIGS. 6-9 depict encapsulant material (e.g.,encapsulant material 690) overlying the top surface of the die (e.g.,die 450). However, to avoid obscuring the underlying features, theencapsulant material is not depicted in the top views of FIGS. 4 and 10.Further, the encapsulant material may be excluded in some embodiments.

Referring first to FIGS. 4 and 6, die 450 includes a semiconductorsubstrate 650 with top and bottom semiconductor substrate surfaces 652,654, and a plurality of dielectric and conductive layers 680 (referredto as “build-up” layers herein) formed over and coupled to the topsemiconductor substrate surface 652. In the various cross sectionalfigures, only the lowest (i.e., closest to substrate 650) and highest(i.e., closest to the top die surface 452) build up layers 680 aredepicted for simplicity, and vertical ellipses “ . . . ” are included toindicate that additional dielectric and conductive layers may beincluded between the lowest and highest build up layers 680. Forexample, the conductive layer 681 closest to the top semiconductorsubstrate surface 652 may be the M1 layer (metal 1 layer), and theconductive layers 682, 683 closest to the top die surface 452 may be theM4 and M5 layers, respectively. For example, conductive layers 681-683may be formed from aluminum-copper-tungsten (AlCuW) or othercommonly-used conductive layer materials. As will be described later,according to an embodiment, all or portions of the metal layer (e.g.,layer 683) included in inductors 416, 417, 434, 435 may includematerials that are different from the materials of underlying metallayers (e.g., layers 681, 682). Although an example embodiment isdescribed herein with five metal layers 681-683 (e.g., M1-M5), a devicemay have more or fewer metal layers, as well. Further, although thebelow description describes inductors 416, 417, 434, 435 and capacitors414, 415, 432, 433 as being formed from portions of particular metallayers 682, 683, the inductors 416, 417, 434, 435 and capacitors 414,415, 432, 433 could be formed from portions of other metal layers, aswell.

The bottom semiconductor substrate surface 654 corresponds to the bottomsurface 554 (FIG. 5) of die 450, and the top surface 658 of the build-uplayers 680 corresponds to the top surface 452 of the die 450. Asmentioned above, encapsulant material 690 (e.g., plastic encapsulant)may be coupled to the top die surface 452, although the encapsulantmaterial 690 may be excluded, in other embodiments.

In various embodiments, the semiconductor substrate 650 may comprisesilicon, silicon-on-insulator (SOI), silicon-on-sapphire (SOS), galliumarsenide (GaAs), gallium nitride (GaN), GaN on silicon carbide, GaN onsilicon, or other types of substrate materials. For example, thesubstrate 650 may have a thickness 651 in a range of about 50 microns toabout 100 microns (e.g., about 75 microns), although the substrate 650may be thinner or thicker, as well. The substrate 650 may include, forexample, a base semiconductor substrate and one or more additionalsemiconductor layers epitaxially formed on the surface of the basesemiconductor substrate. In a particular example embodiment, thesubstrate 650 is a high-resistivity silicon substrate (e.g., a siliconsubstrate having bulk resistivity in a range of about 1000ohm/centimeter (cm) to about 100,000 ohm/cm or greater). Alternatively,the substrate 650 may be a semi-insulating GaAs substrate (e.g., a GaAssubstrate having bulk resistivity up to 10⁸ ohm/cm), or another suitablehigh-resistivity substrate. In such embodiments, and as will bedescribed in detail later, electrical connections between the top andbottom semiconductor substrate surfaces 652, 654 may be made usingconductive through substrate vias (TSVs) (e.g., TSVs 661, 664, 671, 863,865, 869, FIGS. 6, 8). Alternatively, electrical connections between topand bottom semiconductor substrate surfaces 652, 654 may be made usingwrap-around terminations (e.g., wrap-around terminations 760, 770, FIG.7) or using other conductive structures. Still other embodiments may beimplemented using low-resistivity substrates.

A plurality of active and passive components is formed in and oversemiconductor substrate 650. More specifically, each amplifier path 400,401 includes an input circuit (e.g., input circuit 110, FIG. 1) thatincludes at least one inductor 416, 417 (e.g., inductive element 116,FIG. 1) and at least one capacitor 414, 415 (e.g., capacitor 114, FIG.1), a transistor 420, 421 (e.g., transistor 120, FIG. 1), and an outputcircuit (e.g., output circuit 130, FIG. 1) that includes at least oneinductor 434, 435 (e.g., inductive element 134, FIG. 1) and at least onecapacitor 432, 433 (e.g., capacitor 132, FIG. 1). Transistors 420, 421represent the amplification components of amplifier paths 400, 401. Inthe illustrated embodiments, each amplifier path 400, 401 is a singlestage amplifier (e.g., each including one power transistor 420, 421). Inan alternate embodiment, each amplifier path may be implemented as amulti-stage amplifier (e.g., with a pre-amplifier transistor in serieswith a final amplifier transistor). In such an embodiment, a matchingcircuit may be implemented between the pre-amplifier and final amplifierstages.

Through various conductive structures, which will be described in moredetail below, the active and passive components of die 450 areelectrically coupled to each other and to a plurality of conductivefeatures 502, 503, 504, 505, 506 (e.g., conductive components 102, 104,106, 108, FIG. 1) that are coupled to the bottom semiconductor substratesurface 654. Those conductive features 502-506 facilitate electricalconnection of the die's active and passive components to externalcircuitry (e.g., circuitry 140, FIG. 4, and 1850, 1852, 1860, 1862, FIG.18).

Various views of the plurality of conductive features 502-506 are shownin FIGS. 5, 6, 8, and 9. Because the relative locations of theconductive features 502-506 with respect to the other circuitry thatoverlies the top semiconductor substrate surface 652 is relevant to theinventive subject matter, the conductive features 502-506 also areindicated in FIG. 4, although with dashed borders to indicate that theyare not proximate to the top semiconductor substrate surface 652, butinstead are coupled to the bottom die surface 554.

Each of the conductive features 502-506 only partially covers the bottomdie surface 554 to define a number of conductor-less regions 580, 582,584, 586 that span various portions of the bottom die surface 554. Asused herein, a “conductor-less region” is a portion of the bottom diesurface 554 to which no conductive material (or at least no significantquantity of conductive material) is coupled. According to an embodiment,the various conductive features 502-506 are electrically isolated fromeach other across the bottom die surface 554 by the conductor-lessregions 580, 582, 584, 586. Conductor-less regions 584, 586 provide forelectrical separation of the input signals provided to amplifier paths400, 401. As will be described in more detail later, conductor-lessregions 580, 582 are located directly opposite (in a vertical direction,with respect to FIG. 6) portions 480, 482 of the top semiconductorsubstrate surface 652 over which inductors 416, 417, 434, 435 areformed. Because the voltage reference plane is lacking under inductors415, 417, 434, 435 in the device, according to the various embodiments,inductors 415, 417, 434, 435 may be referred to herein as “floating”inductors. Inclusion of the conductor-less regions 580, 582 underfloating inductors 415, 417, 434, 435 may achieve multiple advantages,as will be discussed in more detail later.

According to an embodiment, the conductive features 502-506 each mayform a portion of a patterned conductive layer 655 that is coupled tothe bottom semiconductor substrate surface 654, where voids in thepatterned conductive layer 655 correspond to the conductor-less regions580, 582, 584, 586. Some or all of the conductive features 502-506 maybe directly connected to the bottom semiconductor substrate surface 654,or an insulating layer 656 may be present between some or all of theconductive features 502-506 in order to electrically isolate them fromthe substrate 650, in various embodiments. According to an embodiment,conductive layer 655 includes plated copper (i.e., multiple layersapplied using a plating process) or other conductive metal or metalalloy, and conductive layer 655 has a thickness 657 in a range of about10 microns to about 50 microns. The patterned conductive layer 655 maybe formed from one or more layers of a single conductive material, ormay be formed from layers of different materials. In addition, thepatterned conductive layer 655 may be thinner or thicker than theabove-given range. Alternatively, the conductive features 502-506 may bedistinct structures that are otherwise coupled (e.g., bonded, soldered,adhered, and so on) to the bottom semiconductor substrate surface 654.

In any event conductive features 502, 503 represent input terminals(e.g., two instances of terminal 102, FIG. 1) for the first and secondamplifier paths 400, 401, respectively, and conductive features 504, 505represent output terminals (e.g., two instances of terminal 104, FIG. 1)for the first and second amplifier paths 400, 401, respectively.Conductive feature 506 represents a voltage reference terminal (e.g.,voltage reference terminal 106, FIG. 1), and although the voltagereference terminal is depicted as a single conductive feature 506 in theillustrated embodiments, a set of distinct and separate conductivefeatures alternatively may serve as a plurality of voltage referenceterminals, in an alternate embodiment. Further, conductive features 508,509 (FIGS. 5, 8, 9) represent terminals (e.g., three instances ofterminal 108, FIG. 1) that enable portions of the amplifier paths 400,401 to be coupled to other external circuitry. For example, conductivefeatures 508, 509 may represent RF cold point node terminals (e.g.,multiple instances of RF cold point node terminal 108), which enable RFcold points (e.g., node 148, FIG. 1) to be coupled with externalcircuitry (e.g., with envelope frequency termination circuitry 140, FIG.1). As will be described in more detail later, the nodes betweeninductors 434, 435 and capacitors 432, 433 represent RF cold pointnodes. In addition, conductive features 508, 509 may enable a biasvoltage (e.g., Vdd) to be provided to the drain terminals 424, 425 oftransistors 420, 421 of each amplifier path 400, 401. Although notillustrated, similar conductive features may be provided to an RF coldpoint node in the input circuit, to provide the ability to provide abias voltage to be provided to the control terminals 422, 423 oftransistors 420, 421, as well.

The interconnections between the various components of die 450 alongamplification path 400 will now be described in more detail. It shouldbe understood that substantially similar interconnections may beimplemented along amplification path 401. In any event, and withreference to FIGS. 4-6 and 8, conductive feature 502, which isconfigured to receive an input RF signal, is electrically connected tothe input circuit (e.g., input circuit 110, FIG. 1) through a first setof conductive structures 660 (e.g., conductive structures 160, FIG. 1)that provide a continuous electrical path between conductive feature 502and an input node 461 to the input circuit (e.g., node 161, FIG. 1).According to an embodiment, the first set of conductive structures 660may include one or more TSVs 661, portions of conductive layers 681-683,and conductive vias 663 that electrically couple the portions of theconductive layers 681-683. TSVs 661 may be electrically isolated fromsubstrate 650 with dielectric via lining material 662, in an embodiment,although lining material 662 may be excluded, in other embodiments.

As most clearly depicted in FIGS. 4 and 6, the input circuit for path400 includes inductors 416 (e.g., parallel instances of inductor 116,FIG. 1) and capacitor 414 (e.g., capacitor 114, FIG. 1), and the inputcircuit for path 401 includes inductors 417 (e.g., parallel instances ofinductor 116, FIG. 1) and capacitors 415 (e.g., capacitor 114, FIG. 1).More specifically, the input circuit for path 400 includes inductors416, which are coupled in parallel between node 461 and the controlterminal 422 (e.g., gate) of transistor 420 (e.g., transistor 120, FIG.1). Similarly, the input circuit for path 401 includes inductors 417,which are coupled in parallel between conductive structure 461 and thecontrol terminal 423 of transistor 421. Each of inductors 416, 417 isimplemented as an integrated spiral inductor formed from portions of oneor more conductive layers (e.g., layers 682, 683). The spiral inductorsmay be formed from as few as one conductive layer or from multipleconductive layers, with conductive vias interconnecting the inductorportions, and cross-overs and cross-unders implemented, as appropriate.A first (input) terminal of each inductor 416, 417 is coupled to theinput node of its respective input circuit, and a second (output)terminal of each inductor 416, 417 is coupled through portions 418, 419of a conductive layer (e.g., conductive layer 682) to the controlterminals 422, 423 of transistors 420, 421.

As most clearly depicted in FIGS. 4 and 8, capacitors 414, 415 arecoupled between the input circuit input node (e.g., node 461 for path400) and voltage reference terminal 506 (e.g., terminal 106, FIG. 1).More specifically, a first plate (or electrode) 814 of capacitor 414 iscoupled to node 461 (and thus to the input terminal of inductor 416),and a second plate (or electrode) 815 of capacitor 414 is coupled to thevoltage reference terminal 506 through conductive structures 862 (e.g.,conductive structures 162, FIG. 1). Capacitors 415 are similarly coupledbetween conductive structure 461 and the voltage reference terminal 506.In the illustrated embodiment, capacitors 414, 415 are implemented asmetal-insulator-metal (MIM) capacitors, each of which includesvertically aligned portions of two conductive layers 683, 682 (e.g., thefirst and second capacitor plates 814, 815) and inter-layer dielectricbetween the capacitor plates 814, 815. In addition, conductivestructures 862 may include one or more TSVs 863, portions of conductivelayers 681, 682, and conductive vias 864 that electrically couple theportions of the conductive layers 681, 682. Although not shown, TSVs 863may be electrically isolated from substrate 650 with dielectric vialining material, in an embodiment, although lining material may beexcluded, in other embodiments.

As mentioned previously, transistors 420, 421 may be LDMOS FETtransistors, for example. Each transistor 420, 421 includes a controlterminal 422, 423 (e.g., gate), a first current conducting region (e.g.,a drain region coupled to a drain terminal 424, 425), and a secondcurrent conducting region (e.g., a source region). As discussed inconjunction with FIG. 1, the control terminal is coupled to the inputcircuit 110, one of the current conducting regions (e.g., the drainregion) is coupled to the output circuit 130, and the other currentconducting region (e.g., the source region) is coupled to a voltagereference. Referring now to FIG. 10, which is a top view of portion 10(FIG. 4) of transistor 420, additional details of transistor 420 willnow be described. Reference also will be made to the cross-sectionalview of FIG. 6, for clarity.

Referring to FIG. 10, transistor 420 includes an active area 610, with aplurality of substantially parallel-aligned drain regions 1025 andsource regions 1030 (outlined with dashed rectangles) formed in thesubstrate 650 below the top semiconductor substrate surface 652. Due totheir elongated shapes and interdigitated arrangements, the drain andsource regions 1025, 1030 may be referred to as “fingers.” In any event,drain regions 1025 are electrically coupled to conductive (e.g., metal)drain finger contacts 1024, each of which extends to drain contact 424.Source regions 1030 are electrically coupled to conductive (e.g., metal)source finger contacts 1062, which in turn are coupled to conductiveTSVs 664 (FIG. 6) that extend through substrate 650 to conductivefeature 506 (e.g., voltage reference terminal 106, FIG. 1). TSVs 664 mayor may not be lined with dielectric material to insulate the TSVs 664from the substrate 650, in various embodiments. A variably-conductivechannel and, in some embodiments, a drain drift region are presentbetween adjacent source and drain regions 1030, 1025 of each transistorfinger. Conductive (e.g., polysilicon) gate structures 1022 are coupledto and extend from gate contact 422 across the channel regions so thatvoltages applied to the gate contact 422 during operation may modulatethe conductivity of the channels, and thus the current flow betweensource and drain regions 1030, 1025 (or ultimately between conductivefeature 506 and drain contact 424).

Although a particular layout of an LDMOS FET is illustrated in FIG. 10,it should be understood that many different layouts may be implementedto provide the transistor(s), in various embodiments. For example, insome embodiments, doped sinker regions may be used to provide portionsof the electrical path between the source regions and the conductivefeature 506 at the bottom semiconductor substrate surface 654. Numerousother modifications also may be made, depending on the characteristicsof the selected substrate and the operation and performance of thetransistor.

Referring again to FIGS. 4-6 and 8, drain terminals 424, 425 oftransistors 420, 421 are electrically coupled to conductive features504, 505 (e.g., two instances of terminal 104, FIG. 1) and also tooutput circuits (e.g., two instances of output circuit 130, FIG. 1).Considering first the electrical coupling between drain terminals 424,425 and conductive features 504, 505, the top view of FIG. 4 illustratesmultiple instances of conductive features 472, 474 extending betweendrain terminals 424, 425 and nodes 471, 473 (e.g., multiple instances ofnode 171, FIG. 1). Conductive features 472, 474 may include, forexample, portions of one or more conductive layers 681-683 andconductive vias interconnecting the drain terminals 424, 425 and theportions of the conductive layers 681-683, as appropriate. As mostclearly indicated in the cross-sectional view of FIG. 6, nodes 471, 473are electrically coupled to the conductive features 504, 505 (and thusthe drain terminals 424, 425 are electrically coupled to the conductivefeatures 504, 505). For example, FIG. 6 depicts node 471 as beingcoupled to conductive feature 504 through a set of conductive structures670 (e.g., node 171 is coupled to terminal 104 through conductivestructure 170, FIG. 1). The set of conductive structures 670 provides acontinuous electrical path between node 471 and conductive feature 504.According to an embodiment, the set of conductive structures 670 mayinclude one or more TSVs 671, portions of conductive layers 681-683, andconductive vias 673 that electrically couple the portions of theconductive layers 681-683. TSVs 671 may be electrically isolated fromsubstrate 650 with dielectric via lining material 672, in an embodiment,although lining material 672 may be excluded, in other embodiments. Inany event, when die 450 is incorporated into an amplifier system,conductive features 504, 505 are configured to output the amplified RFsignals produced by transistors 420, 421.

As mentioned above, the drain terminals 424, 425 also are electricallyconnected to the output circuits (e.g., two instances of output circuit130, FIG. 1). As most clearly depicted in FIGS. 4 and 6, the outputcircuit for path 400 includes inductors 434 (e.g., parallel instances ofinductor 134, FIG. 1) and capacitor 432 (e.g., capacitor 132, FIG. 1),and the output circuit for path 401 includes inductors 435 (e.g.,parallel instances of inductor 134, FIG. 1) and capacitors 433 (e.g.,capacitor 132, FIG. 1). More specifically, the output circuit for path400 includes inductors 434, which are coupled in parallel between drainterminal 424 (or node 471) and node 442 (e.g., node 142, FIG. 1). Inaddition, as most clearly depicted in FIG. 8, the output circuit alsoincludes capacitor 432, which is coupled between node 442 and conductivefeature 506 through another set of conductive structures 866.

Each of inductors 434, 435 is implemented as an integrated spiralinductor formed from portions of one or more conductive layers (e.g.,layers 682, 683). The spiral inductors may be formed from as few as oneconductive layer or from multiple conductive layers, with conductivevias interconnecting the inductor portions, and cross-overs andcross-unders implemented, as appropriate. According to an embodiment, atleast the portion of top conductive layer 683 that includes inductors416, 417, 434, 435 may be formed from or include a material that isdifferent from (e.g., more highly conductive than) the material(s) fromwhich the lower metal layers 681, 682, and/or other portions of layer683 are formed. For example, as illustrated in FIG. 6, portions of layer683 corresponding to inductors 416, 417, 434, 435 may include multipleconductive material layers 684, 685. For example, the bottom conductivematerial layer 684 may comprise AlCuW (or some other material), asdiscussed previously, and the top conductive material layer 685 maycomprise copper (Cu) or some other highly conductive material.Alternatively, the portions of layer 683 corresponding to some or all ofinductors 416, 417, 434, 435 may include a single layer of the morehighly conductive material (e.g., Cu). The inclusion of the highlyconductive material may increase the Q of inductors 416, 417, 434, 435,which may be particularly advantageous for inductors 434, 435 in theoutput circuit, since the Q of inductors 434, 435 on the higher-powerside of the amplifier path 400 may more significantly affect theefficiency of the amplifier than the Q of inductors 416, 417 on thelower-power side of the amplifier path 400. In still other embodiments,the portions of layer 683 corresponding to some or all of inductors 416,417, 434, 435 may include substantially the same materials as the otherlayers 681, 682.

A first (input) terminal of each inductor 434, 435 is coupled thoughportions 436, 437 of a conductive layer (e.g., conductive layer 682) tothe drain terminal 424, 425 of transistors 420, 421, respectively. Asshown most clearly in FIGS. 4, and 9, a second (output) terminal of eachinductor 434, 435 is coupled to nodes 442, 444. As discussed previouslyin the description of FIG. 1, the values of inductor 434 and capacitor432 may be selected so that node 442 (or node 142, FIG. 1) betweeninductor 434 and capacitor 432 functions as an RF cold point node.

As most clearly depicted in FIGS. 4 and 8, capacitors 432, 433 arecoupled between node 442 for path 400) and voltage reference terminal506 (e.g., terminal 106, FIG. 1). More specifically, a first plate (orelectrode) 816 of capacitor 432 is coupled to node 442 (and thus to theoutput terminal of inductor 434), and a second plate (or electrode) 817of capacitor 432 is coupled to the voltage reference terminal 506through conductive structures 866 (e.g., conductive structures 166, FIG.1). Capacitors 433 are similarly coupled between nodes 444 and thevoltage reference terminal 506. In the illustrated embodiment,capacitors 432, 433 are implemented as MIM capacitors, each of whichincludes vertically aligned portions of two conductive layers 683, 682(e.g., the first and second capacitor plates 816, 817) and inter-layerdielectric between the capacitor plates 816, 817. In addition,conductive structures 866 may include one or more TSVs 865, portions ofconductive layers 681, 682, and conductive vias 867 that electricallycouple the portions of the conductive layers 681, 682. Although notshown, TSVs 865 may be electrically isolated from substrate 650 withdielectric via lining material, in an embodiment, although liningmaterial may be excluded, in other embodiments.

As discussed previously, nodes 442, 444 may represent RF cold pointsbetween inductors 434, 435 and capacitors 432, 433. According to anembodiment, die 450 includes further conductive features thatelectrically couple RF cold point nodes 442, 444 to terminal 508, 509(e.g., multiple instances of terminal 108, FIG. 1), which provides theability to couple external circuitry (e.g., circuitry 140, FIG. 1) tothe RF cold point nodes 442, 444. As most clearly depicted in FIGS. 8and 9, for example, along path 400, die 450 includes conductivestructures 868 (e.g., conductive structures 168, FIG. 1) thatelectrically couple RF cold point node 442 and terminal 508. Conductivestructures 868 may include one or more TSVs 869, portions of conductivelayers 681-683, and conductive vias 871 that electrically couple theportions of the conductive layers 681-683. TSVs 869 may be electricallyisolated from substrate 650 with dielectric via lining material 870, inan embodiment, although lining material 870 may be excluded, in otherembodiments.

In the above-described embodiments, conductive structures 660, 670, 862,866, 868 (including TSVs 661, 671, 863, 865, 869) are used to provideelectrical connections between components formed over the topsemiconductor substrate surface 652 and conductive features 502-506coupled to the bottom semiconductor substrate surface 654. In alternateembodiments, alternative conductive structures may be implemented toreplace all or portions of conductive structures 660, 670, 862, 866,868. For example, in an alternate embodiment depicted in FIG. 7 (whichcorresponds in location to the cross-sectional view of FIG. 6),conductive structures 660, 670 may be replaced with conductivewrap-around terminations 760, 770 which are coupled to side surfaces ofdie 750 to interconnect conductive features 702, 704 with the input andoutput circuits located over the top semiconductor substrate surface752. The wrap-around terminations 760, 770 may be electrically isolatedfrom substrate 752 with dielectric material 762, 772, in an embodiment,although the dielectric material 762, 772 may be excluded, in otherembodiments. In other alternate embodiments, other types of conductivestructures (e.g., printed conductive lines, wirebonds, and so on) may beused to interconnect conductive features corresponding to the input andoutput terminals with the input and output circuits, respectively. Instill other alternate embodiments, some or all of conductive structures862, 866, 868 may be similarly replaced with wrap-around terminations orother types of conductive structures.

Die 450 is shown to include portions of two parallel amplifier paths400, 401. In such an embodiment, one or more isolation features 490 maybe embedded within the die 450, within encapsulant 490, or otherwiseinterposed between the parallel amplification paths 400, 401 in order toreduce potential signal interference between the two paths. Further, thetransistors 420, 421 of amplifier paths 400, 401 are of different sizes,as indicated by their different areas. Accordingly, the transistors 420,421 may have different current-carrying capacities. For example,transistor 421 may be capable of handling twice the current oftransistor 420. Such an arrangement may be particularly advantageous,for example, in an asymmetric Doherty amplifier (e.g., Doherty amplifier1800, FIG. 18), in which the peaking amplifier may be significantlylarger than the main amplifier. In an alternate embodiment, transistors420, 421 may be substantially the same in size and/or current carryingcapacity (e.g., for use in a symmetric Doherty amplifier or another typeof amplifier).

Although die 450 is shown to include two parallel amplifier paths 400,401, alternate embodiments of die may include a portion of a singleamplifier path. Still other alternate embodiments of die may includeportions of more than two amplifier paths. In the illustratedembodiment, the first and second amplifier paths 400, 401 may correspondto main and peaking amplifier paths, respectively, of a Dohertyamplifier. Alternatively, the first and second amplifier paths 400, 401may be incorporated into other types of amplifiers, as well. Forconciseness, only amplifier path 400 will be described in detail, itbeing understood that amplifier path 401 includes substantially similarfeatures.

Although the embodiments of FIGS. 4-10 embody circuitry corresponding tothe amplifier configuration 100 of FIG. 1, it should be understood thatalternate embodiments of IC devices may embody differently configuredamplifiers (e.g., amplifiers 200, 300, FIGS. 2, 3, or other differentlyconfigured amplifiers). A common aspect to the various embodiments isthe inclusion of one or more “floating” inductors in the input and/oroutput circuits of an amplifier path. Those of skill in the art wouldunderstand, based on the description herein, how to incorporate one ormore of such floating inductors into differently configured amplifierICs.

FIG. 11 is a flowchart of a method of manufacturing a device (e.g., die450) that includes at least a portion of an amplifier. As will bediscussed below, wafer-level chip-scale packaging (WLCSP) techniques maybe used to complete the device so that it may readily be coupled to aPCB that includes other portions of an amplifier (e.g., a Dohertyamplifier 1800, FIG. 18, or another type of amplifier), in accordancewith an example embodiment. Alternatively, after formation of die 450,the die 450 may be coupled to leads (e.g., leads 1202-1205, FIG. 12)and/or a flange or heat sink (e.g., heat sink 1206, FIG. 12), and theleaded assembly (e.g., device 1500, FIG. 15) may be coupled (e.g.,soldered) to a PCB (e.g., PCB 1610, FIG. 16) that includes otherportions of an amplifier.

In block 1102, wafer manufacturing techniques are used to fabricate awafer that includes a multitude of instances of the above-describedamplifier circuitry (e.g., a multitude of die sites, each of whichincludes the circuitry of die 450). Although conventional waferfabrication techniques are not discussed in detail herein for thepurpose of brevity, fabrication of the wafer includes processes in whichvias (e.g., vias 661, 664, 671, 863, 865, 869) are formed through asemiconductor substrate (e.g., substrate 650), and various activedevices (e.g., transistors 420, 421) and passive devices (e.g.,inductors 416, 417, 434, 435 and capacitors 415, 415, 432, 433), alongwith their interconnections, are formed in and over a top surface of thewafer. The back side of the wafer may then be thinned to a desiredthickness, which exposes bottom-side ends of the vias. Conductivefeatures (e.g., conductive features 502, 504, 506, 508) are then coupledto the bottom surface of the thinned wafer. For example, a thickpatterned back metal layer may be applied to the bottom surface of thewafer produce the conductive features.

According to an embodiment, encapsulation (e.g., encapsulation 690) maythen be applied to the top surface of the wafer over the transistors andpassive devices, in block 1104. Alternatively, encapsulation step 1104may be excluded.

In block 1106, the wafer is diced along saw streets to singulate theindividual die (e.g., die 450) from the wafer. At this point, the die450 may be considered to be a “package-less” product, which may bedirectly coupled (e.g., soldered) to a PCB that includes other portionsof the amplifier within which device 400 is to be incorporated.

Alternatively, as is further illustrated in FIGS. 12-15, the die may bepackaged. According to an embodiment, packaging essentially includescoupling each singulated die to a leadframe, in block 1108, andencapsulating the assembly, in block 1110. The process of attaching thedies to a leadframe (block 1108) may be performed in a parallel process,according to an embodiment, using a matrix leadframe, strip, or otherleadframe structure.

FIG. 12 illustrates a matrix leadframe 1200, which includes a pluralityof sets of leadframe features arranged in rows in columns. In analternate embodiment, the leadframe feature sets may be arranged in astrip (or single row), rather than a matrix. In the illustratedembodiment, each set of leadframe features includes two conductiveinput-side leads 1202, 1203, two conductive output-side leads 1204,1205, and a conductive flange 1206 (or heat sink). In alternateembodiments, each set of leadframe features may include more or fewerinput and/or output leads, and/or may include additional leads (e.g.,for biasing, coupling to external circuitry, and so on). Further, flange1206 may be excluded, in some embodiments. The leads 1202-1205 andflange 1206 may have similar thicknesses, or they may have differentthicknesses. For example, as indicated in FIG. 15, leads 1202-1205 mayhave a first thickness (e.g., between about 0.15 millimeter (mm) andabout 0.25 mm), and flange 1206 may have a second thickness (e.g.,between about 0.48 mm and about 1.27 mm), which may better suit flangeto function as a heat sink to remove heat from the die 450 duringoperation.

The various leadframe features 1202-1206 are structurally coupledtogether by sacrificial rails 1220 and sacrificial connectors 1222. Toclearly differentiate the leadframe features 1202-1206 from thesacrificial features 1220, 1222, the leadframe features 1202-1206 arecross-hatched in FIG. 12. In actuality, the leadframe and sacrificialfeatures 1202-1206, 1220, 1222 may be integrally formed from the samematerial (e.g., a skived or milled leadframe formed from copper oranother material), in some embodiments. Alternatively, some or all ofthe leadframe and sacrificial features 1202-1206, 1220, 1222 may beformed from distinct structures that are otherwise coupled together. Forexample, the leads 1202-1205 and/or flange 1206 may be distinctstructures that are staked to the sacrificial features 1220, 1222.

Referring now to FIG. 13, a singulated die 450 may be coupled to eachleadframe set in block 1108. More specifically, and as more clearlyindicated in the cross-sectional view of FIG. 15, the conductivefeatures 502-506 on the bottom die surface are coupled to correspondingleadframe features 1202-1206. For example, conductive features 502, 503corresponding to signal inputs for amplifier paths 400, 401 may becoupled to leads 1202, 1203, respectively, conductive features 504, 505corresponding to signal outputs for amplifier paths 400, 401 may becoupled to leads 1204, 1205, respectively, and voltage reference feature506 may be coupled to flange 1206, in an embodiment. Coupling of the die450 to the leadframe features 1202-1206 may be accomplished, forexample, using solder, conductive adhesive, brazing, sintering, or otherdie attach techniques.

Referring now to FIG. 14, the assembly (i.e., dies 450 and leadframe1200) may be encapsulated, in block 1110. In various embodiments,encapsulation may utilize transfer molding (including film assistedmolding), compression molding, or other techniques. For example, toproduce packaged devices with exposed leads (e.g., device 1500, FIG.15), the assembly may be placed in a mold, and encapsulant material 1490(e.g., thermoset plastic or resin) may be asserted into mold cavitiesthat correspond to areas in which the encapsulant material 1490 isdesired (i.e., areas over the dies 450, under the dies 450, and portionsof the leads 1202-1205). Alternatively, to produce “no leads” types ofpackaged devices (i.e., packaged devices in which the leads do notextend from the sides of the encapsulant material), encapsulant materialmay be applied over the entire top surface of the assembly.

The devices then may be separated, in block 1110, by removing thesacrificial features 1220, 1222 of the leadframe assembly 1200. Forexample, FIG. 15 illustrates a cross-sectional side view of a device1500 (e.g., a cross section along line 15-15 of FIG. 14), which includesa die 450 with attached leads 1202, 1204 and flange 1206, which isencapsulated with encapsulant material 1490.

In block 1112, the device 1500 may then be coupled to an electricalsystem. For example, the electrical system may have additional circuitryconfigured to provide one or more input RF signals (e.g., to leads 1202,1203), to receive amplified RF signals produced by the device 1500(e.g., through leads 1204, 1205), and to provide a voltage reference(e.g., ground, through flange 1206). Referring to FIG. 16, coupling thedevice 1500 to an electrical system may include, for example, couplingthe device 1500 to a PCB 1610, which includes one or more dielectricmaterial layers 1620 (e.g., FR-4 or other PCB dielectrics) and one ormore conductive layers 1630, 1632. Although only one dielectric materiallayer 1620 and two conductive layers 1630, 1632 are shown in FIG. 16,the PCB 1610 may include more than one dielectric material layer, and/ormore than two conductive layers. Further, in other embodiments, thedevice 1500 may be coupled to a substrate other than a PCB.

To electrically and mechanically couple device 1500 to the PCB 1610,each lead 1202-1205 may be soldered or otherwise coupled tocorresponding pads or traces formed from a first conductive layer 1630of the PCB 1610. According to an embodiment, the second conductive layer1632 of the PCB 1610 may extend into an opening 1640 in the PCB 1610,which is sized to accept the flange 1206. The flange 1206 may besoldered or otherwise coupled to the portions of the second conductivelayer 1632 that extend into the opening 1640. In such a manner, theflange 1206 may function both as a heat sink, and as a connection to avoltage reference (e.g., ground), when the second conductive layer 1632is coupled to the voltage reference. In alternate embodiments, the PCBmay include an embedded conductive coin that functions as a heat sinkand as a connection to a voltage reference plane. In such an embodiment,flange 1206 may be excluded or may be substantially thinner (e.g.,approximately the same thickness as leads 1202-1205.

Importantly, as can be seen in FIG. 16, the vertical distance 1650between the floating inductors 416, 434 and the voltage reference plane(i.e., conductive layer 1632) is substantially greater than the distance1652 between the floating inductors 416, 434 and the patternedconductive layer 655 on the bottom surface of die 450. For example,distance 1650 may be in a range of about 5 mils to about 50 mils ormore, depending on the cumulative thickness of the die 450, theconductive back metal (e.g., layer 655), the leads (e.g., leads 1202,1204), and the PCB 1610, where most of the thickness is contributed bythe PCB 1610, whereas distance 1652 more typically may be in a range ofabout 50 microns (2 mils) to about 100 microns (4 mils). In someembodiments, portions of the conductive layer 1632 underlying theinductors 416, 434 could be removed, resulting in the distance 1650 toany virtual ground plane being even further increased.

The lack of a continuous voltage reference plane coupled to the bottomsurface of substrate 450 (i.e., the inclusion of conductor-less regionsunder “floating” inductors 416, 417, 434, 435, according to the variousembodiments) may achieve one or more of multiple advantages. First, byexcluding the conductive feature 506 underneath inductors 416, 417, 434,435, the quality factor (Q) of inductors 416, 417, 434, 435 may besignificantly increased, when compared with inductors implemented in diethat lack the conductor-less regions of the various embodiments (e.g.,in die that have a continuous ground plane across its entire bottomsurface). In conventional devices, spiral inductor Q is limited bysubstrate loss, metal loss, and/or capacitive coupling due to closeproximity of the voltage reference plane. Accordingly, many RF devicesinclude higher-Q wirebonds to provide inductances, rather than usingintegrated spiral inductors. However, implementation of the “floatinginductors” 416, 417, 434, 435 of the present embodiments overcomelimitations of conventional spiral inductors, resulting in inductorswith significantly higher Q than conventional integrated inductors.

The higher Q of inductors 416, 417, 434, 435 is achieved in severalways, in the above discussed embodiments. First, and as describedpreviously, the voltage reference plane underlying inductors 416, 417,434, 435 essentially is “pushed away” (in distance) from inductors 416,417, 434, 435. Although a voltage reference plane (e.g., a ground plane)may be located on a PCB or other substrate to which device 400ultimately is coupled (e.g., voltage reference plane 1632 on PCB 1610,FIG. 16), and that voltage reference plane may underlie inductors 416,417, 434, 435, the distance between the inductors 416, 417, 434, 435 andthe voltage reference plane may be made to be significantly greater thanthe distance that otherwise would be present if conductive feature 506extended underneath inductors 416, 417, 434, 435, as shown in FIG. 16and explained above. In addition, as discussed previously, the inclusionof a highly-conductive material (e.g., copper) in at least the portionsof the top metal layer (e.g., layer 683) from which inductors 416, 417,434, 435 are formed may further increase the Q of inductors 416, 417,434, 435.

This combination of features of device 400 results in a significantlyhigher Q for the inductors 416, 417, 434, 435. For example, FIG. 17 is achart illustrating inductor Q with respect to frequency for aconventional spiral inductor (e.g., a spiral inductor implemented in adie with a continuous conductive ground plane on its bottom surface) andan inductor implemented according to an embodiment (e.g., one ofinductors 416, 417, 434, 435) on a die (e.g., die 450) that is mountedon a PCB (e.g., PCB 1610). More specifically, trace 1710 representsinductor Q with respect to frequency for a spiral inductor that isspaced approximately 75 microns from an underlying ground plane (e.g., aconventional spiral inductor), and trace 1720 represents inductor Q withrespect to frequency for a spiral inductor that is spaced approximately500 microns from an underlying ground plane (e.g., a spiral inductorimplemented with an underlying conductor-less region and with the groundplane underlying the inductor comprising a portion of a PCB conductivelayer). As the chart indicates, at a frequency of about 3.5 GHz, theconventional inductor has a Q of approximately 28, and an inductoraccording to an embodiment has a Q of about 43. Given the same spacingbetween the inductor and the ground plane, the frequency of maximum Qfor the inductor is a function of the inductance value. Accordingly, themaximum Q point may be moved to lower or higher frequencies than thosedepicted in FIG. 17.

As the above description and the example results in FIG. 17 indicate,whereas a conventional integrated inductor with an underlying voltagereference plane coupled to the die may have a Q of 25-35 or less,integrated inductors 416, 417, 434, 435 may achieve a Q of greater than40 or more (e.g., including Q factors greater than 65), in someembodiments. The features of the various embodiments that result inincreased Q may be particularly advantageous when implemented withrespect to inductors 434, 435 of the output circuit (e.g., outputcircuit 130, FIG. 1), because the Q of inductors 434, 435 significantlyaffects the efficiency of the device 400 and amplifier.

In addition to achieving higher Q inductance, implementation of thevarious embodiments enabled the inductance density of the device to beincreased. Because a spiral inductor essentially is a transmission line,a capacitance component is present between a spiral inductor and avoltage reference plane over which the inductor is positioned. Bypushing away the voltage reference plane, the capacitance portion isreduced and the inductance is raised (when compared with an inductorwith a closer voltage reference plane).

Further, reduction or elimination of inductors implemented usingwirebonds may significantly simplify and reduce the cost of back-endassembly processes. More specifically, the specialized equipment used toattach and shape wirebond arrays to device leads and between devicecomponents to achieve desired inductances may be eliminated from theback-end production equipment. Further, elimination of wirebond arraysalso eliminates the inductive coupling between those arrays, whichotherwise may detrimentally affect performance.

Embodiments of amplifier die (e.g., die 450 or other die with more orfewer amplifier paths) may be incorporated into any of a variety ofdifferent types of amplifier systems, as discussed previously. Forexample, a two-path die, such as die 450, may be incorporated into atwo-way Doherty power amplifier, which includes a main amplifier pathand a single peaking amplifier path. Such an embodiment is illustratedin FIG. 18, which is a simplified block diagram of a Doherty poweramplifier 1800. Amplifier system 1800 includes an input node 1801, anoutput node 1870, a power divider 1840, an RF amplifier device 1850(e.g., die 450 or device 1500), and a power combiner 1860, according toan embodiment. The power divider 1840 is coupled between input node 1801and input terminals 1802, 1803 to the RF amplifier device 1850, and thepower combiner 1860 is coupled between output terminals 1804, 1805 ofthe RF amplifier device 1850 and output node 1870. An input signalreceived at input node 1801 is amplified by amplifier system 1800 andprovided to a load 1880 (e.g., an antenna) via output node 1870.

More specifically, during operation, the power divider 1840 isconfigured to divide the power of the input signal received at node 1801into multiple portions (e.g., equal portions) of the input signal, whererespective portions of the input signal are provided to input terminals1802, 1803. For example, a first output of the power divider 1840 may becoupled to the input terminal 1802 corresponding to the first amplifierpath 1822, and a second output of the power divider 1840 may be coupledto the input terminal 1803 corresponding to the second amplifier path1823. The power divider 1840 may divide the input power equally amongthe amplifier paths 1822, 1823, such that roughly half of the inputsignal power is provided to each amplifier path 1822, 1823.Alternatively, the power divider 1840 may divide the power unequally.

The amplifier system 1800 includes a first phase inversion element 1842between the second output of the power divider 1840 and the inputterminal 1803 corresponding to the peaking amplifier path 1823. Forexample, the first phase inversion element 1842 may be implemented as aquarter wave transmission transformer (e.g., a 90° phase lengthtransmission line) or a lumped element implementation of a 90° phasetransformer. Amplifier system 1800 also includes a second phaseinversion element 1862 between the output terminal 1804 corresponding tothe main amplifier path 1822 and a summing node 1864 of the powercombiner 1860. The output terminal 1805 for the peaking amplifier path1823 also is coupled to the summing node 1864. As with the first phaseinversion element 1842, the second phase inversion element 1862 may beimplemented as a quarter wave transmission transformer (e.g., a 90°phase length transmission line) or a lumped element implementation of a90° phase transformer. The combination of phase inversion elements 1842,1862 ensures that the currents ultimately provided to summing node 1864by the respective amplifier paths 1822, 1823 are provided substantiallyin-phase with each other. Accordingly, the current provided by summingnode 1864 to output node 1870 (and to load 1880) represents the in-phasesummation of the currents provided by amplifier paths 1822, 1823.

In an alternate embodiment, positive and negative phase shifts may beapplied along both amplifier paths 1822, 1823 at the inputs of thedevice 1850 to achieve approximately 90° of phase difference between thesignals processed through the device 1850 along the main and peakingamplifier paths 1822, 1823. Similarly, positive and negative phaseshifts may be applied along both amplifier paths 1822, 1823 at theoutputs of the device 1850 to ensure that the signals are combined inphase at summing node 1864. In another alternate embodiment, theamplifier system may be configured in an “inverted Doherty”configuration. In such a configuration, the input side phase inversionelement is included at the input to the main amplifier path (rather thanat the input to the peaking amplifier path), and the output side phaseinversion element is included at the output of the peaking amplifierpath (rather than at the output of the main amplifier path).

The RF amplifier device 1850 includes multiple amplifier paths 1822,1823 (e.g., amplifier paths 400, 401, FIG. 4). Each amplifier path 1822,1823 includes an input impedance matching circuit (INPUT CKT) 1810, 1812(e.g., input circuits 110, 210, 310), one or more amplifier stages 1820,1821 (e.g., transistors 120, 420, 421), and an output impedance matchingcircuit (OUTPUT CKT) 1830, 1832 (e.g., output circuits 130, 230, 330)coupled in series between input terminals 1802, 1803 (e.g., conductivefeatures 502, 503 and/or leads 1202, 1203) and output terminals 1804,1805 (e.g., conductive features 504, 505 and/or leads 1204, 1205) of thedevice 1850. In addition, each amplifier stage 1820, 1821 may be coupledto a voltage reference plane (e.g., ground) through terminals 1806(e.g., conductive feature 506 and/or flange 1206).

Each of the input impedance matching circuits 1810, 1812 is configuredto provide a desired input impedance at its respective input terminal1802, 1803 at the fundamental frequency (or carrier frequency) of theamplifier system 1800. As discussed previously, each input impedancematching circuit 1810, 1812 may be implemented as a low pass filtercircuit (e.g., input circuit 110, FIG. 1), a high pass filter circuit(e.g., input circuit 210, FIG. 2), or a bandpass filter circuit (e.g.,input circuit 310, FIG. 3), which may include various configurations ofinductors and capacitors (e.g., inductors 116, 216, 316, 317, 416, 417and capacitors 114, 214, 314, 315, 414, 415).

According to various embodiments, Doherty amplifier 1800 may be asymmetrical Doherty amplifier or an asymmetrical Doherty amplifier.Accordingly, the amplifier stages 1820, 1821 may be symmetrical (i.e.,substantially the same size) or asymmetrical (i.e., of different sizes,as illustrated in FIG. 4). In the Doherty configuration, amplifier stage1820 may be configured and operated as a main amplifier, and amplifierstage 1821 may be configured as and operated as a peaking amplifier. Themain amplifier stage 1820 is configured as a Class AB amplifier, meaningthat the transistor arrangement of main amplifier stage 1820 is biasedto provide a conduction angle between 180 and 360 degrees. Conversely,the peaking amplifier stage 1821 is realized as a transistor arrangementconfigured as a Class C amplifier, meaning that the transistorarrangement of the peaking amplifier stage 1821 is biased to provide aconduction angle less than 180 degrees. For example, bias voltages maybe provided to the main and peaking amplifier stages 1820, 1821 (e.g.,to RF cold points 442, 443) through terminals 1808, 1809 (e.g., throughconductive features 508, 509), each of which may coupled to anappropriate bias voltage. Alternatively, the peaking amplifier stage1821 may be connected (e.g., through conductive feature 509) to externalcontrol circuitry that dynamically adjusts the peaking amplifier'soperating mode between Class AB and Class C at the RF signal's enveloperate depending on instantaneous output power requirements. The main andpeaking amplifier stages 1820, 1821 also may be coupled to othercircuitry through terminals 1808, 1809 (e.g., envelope frequencytermination circuitry or other circuitry).

Each of the output impedance matching circuits 1830, 1832 is configuredto provide a desired output impedance at its respective output terminal1804, 1805 at the fundamental frequency of the amplifier system 1800. Inan exemplary embodiment, the amplifier system 1800 is used to transmitRF signals, and the fundamental frequency (or carrier frequency) is thefrequency of transmittance. As discussed previously, each outputimpedance matching circuit 1830, 1832 may be implemented as a high passfilter circuit (e.g., output circuit 130, FIG. 1), a low pass filtercircuit (e.g., output circuit 230, FIG. 2), or a bandpass filter circuit(e.g., output circuit 330, FIG. 3), which may include variousconfigurations of inductors and capacitors (e.g., inductors 134, 234,334, 335, 434, 435 and capacitors 132, 232, 332, 333, 432, 433).

According to an embodiment, the input impedance matching circuits 1810,1812 are substantially identical to each other (e.g., low pass, highpass, or bandpass circuits), and the output impedance matching circuits1830, 1832 also are substantially identical to each other (e.g., highpass, low pass, or bandpass circuits). In other embodiments, the inputimpedance matching circuits 1810, 1812 may be different from each other,and/or the output impedance matching circuits 1830, 1832 may bedifferent from each other. It should be noted that the subject matterdescribed herein is not intended to be limited to any particularconfiguration and/or circuit topology for the input impedance matchingcircuits 1810, 1812 and the output impedance matching circuits 1830,1832.

According to an embodiment, the multiple amplifier paths 1822, 1823 allare contained in a single integrated circuit die (e.g., die 450) withthe input and output terminals 1802-1805 providing external electronicconnectivity to the device 1850. More specifically, the input and outputterminals 1802, 1803, 1804, 1805 generally represent the package leads,pins, or other physical interfaces for creating electrical connectionsto the internal components (e.g., amplifier paths 1822, 1823) of the RFamplifier device 1850. Referring to the previously describedembodiments, for example, input terminals 1802, 1803 may correspond toinput leads 202, 702, 703, 802, and output terminals 1804, 1805 maycorrespond to output leads 204, 704, 705, 804, 805.

According to an embodiment, the components (e.g., inductor, capacitors,resistors, and other components) of each input impedance matchingcircuit 1810, 1812 and each output impedance matching circuit 1830, 1832may be implemented in on the same die as amplifier stages 1820, 1821(e.g., on die 450). Alternatively, one or more components of each inputand/or output impedance matching circuit may be implemented on aseparate die (e.g., an integrated passive device die) or as a discretecomponent or set of wirebonds. In still other alternate embodiments,some or all of the components of amplifier path 1822 may be implementedon one die, and some or all of the components of amplifier path 1823 maybe implemented on another distinct die. Further, an amplifier mayinclude as few as one amplifier path, or an amplifier (including aDoherty amplifier) may include more than two amplifier paths, in variousembodiments. In a multi-path amplifier, the amplifier paths may beimplemented on a single die or on multiple die, in various embodiments.Finally, although single-stage amplifier paths 1822, 1823 are shown inFIG. 18, embodiments may be implemented using multi-stage amplifierpaths, as well.

It should be understood that FIG. 18 is a simplified representation ofan amplifier system 1800 for purposes of explanation and ease ofdescription, and that practical embodiments may include other devicesand components to provide additional functions and features, and/or theamplifier system 1800 may be part of a much larger electrical system, aswill be understood. For example, as implied previously, embodiments ofdevices discussed herein may be incorporated into amplifiers having asingle amplification path or more than two amplification paths, as wellas amplifiers having configurations other than Doherty configurations.

In the above-described embodiments, portions of an amplifier areimplemented monolithically in a single semiconductor die (e.g.,semiconductor die 450, FIG. 4), which may be packaged using WLCSPtechniques to form an RF amplifier device (e.g., RF amplifier device1500, FIG. 15), as described above. The device thereafter may be coupledto a PCB (e.g., PCB 1610, FIG. 16) that includes other portions of theamplifier system (e.g., power divider 1840 and power combiner 1860, FIG.18).

In another embodiment, portions of an amplifier that are monolithicallyimplemented in a single semiconductor die (e.g., semiconductor die 450,FIG. 4) may be incorporated more directly into an amplifier “module,”which also includes other portions of an amplifier system. As usedherein, a “module” means an electronic circuit that includes a pluralityof electrical components that are coupled to a common module substrate.FIG. 19 is a block diagram of a more complicated amplifier system 1900,in accordance with an embodiment, and for which some or all of theamplifier system components may be included within a packaged amplifiermodule (e.g., amplifier module 2400, FIG. 24).

Similar to amplifier system 1800 (FIG. 18), amplifier system 1900includes a Doherty power amplifier. However, amplifier system 1900includes additional components that may enhance the performance of theDoherty power amplifier. More specifically, amplifier system 1900includes an input terminal 1902, an output terminal 1904, a modifiablesignal adjustment device 1910 that includes a power divider 1912, an RFamplifier device 1930 (e.g., die 450), a power combiner 1950, a microcontroller 1960, memory 1962, and bias circuitry 1970, according to anembodiment. Amplifier system 1900 is configured in a Doherty amplifiertopology, which includes amplifier stages 1940, 1942 disposed alongparallel amplification paths 1906, 1908. More specifically, amplifiersystem 1900 is a two-stage Doherty amplifier, which includes a mainamplifier stage 1940 (biased in a class-AB mode during operation) alonga first amplification path 1906, and a peaking amplifier stage 1942(biased in a class-C mode during operation) along a second amplificationpath 1908.

According to an embodiment, the signal adjustment device 1910 has aninput node 1911 and multiple output nodes 1919, 1921, and is coupledbetween input terminal 1902 and input terminals (not labeled) to theamplifier device 1930. Signal adjustment device 1910 includes a powersplitter 1912, multiple RF signal adjustment circuits (includingelements 1914, 1916, 1918, 1920), a controller circuit 1922, and adigital interface 1928. The power splitter 1912 is configured to splitthe power of the input signal received at terminal 1902 and node 1911into two signals provided to the two amplification paths 1906, 1908 atnodes 1913 and 1915, respectively. The power splitter 1912 also mayapply phase shifts to either or both signals to achieve a phasedifference (typically a value of 90 degrees) between the signal carriedalong one of the amplification paths and the signal carried along theother amplification path. In other words, power splitter 1912 adjuststhe phase(s) of either or both signals so that the signals carried alongthe two amplification paths 1906, 1908 are out of phase (e.g., 90degrees out of phase), with respect to each other. The power splitter1912 may divide the input power equally between the amplification paths1906, 1908, such that roughly 50 percent of the input signal power isprovided to each amplification path 1906, 1908. Alternatively, the powersplitter 1912 may divide the input power unequally between theamplification paths 1906, 1908.

Within the signal adjustment device 1910, the RF signal adjustmentcircuits are coupled between the outputs of the power splitter 1912 (ornodes 1913, 1915) and the inputs to the amplifier stages 1940, 1942 (ornodes 1919, 1921). For example, a first RF signal adjustment circuit mayinclude a first adjustable phase shifter 1914 and a first adjustableattenuator 1918 coupled between nodes 1913, 1919 along the firstamplification path 1906, and a second RF signal adjustment circuit mayinclude a second adjustable phase shifter 1916 and a second adjustableattenuator 1920 coupled between nodes 1915, 1921 along the secondamplification path 1908. The adjustable phase shifters 1914, 1916 andadjustable attenuators 1918, 1920 enable adjustments to be made in thephase and amplitude (or attenuation) of the signals along amplificationpaths 1906, 1908, in order to provide optimal balancing between the RFsignals provided to amplifier stages 1940, 1942.

Although the adjustable phase shifters 1914, 1916 are shown to precedethe adjustable attenuators 1918, 1920 along amplification paths 1906,1908, the phase shifters 1914, 1916 and attenuators 1918, 1920 may bereversed in order, in an alternate embodiment. In alternate embodiments,some or all of the phase shifters 1914, 1916 and/or attenuators 1918,1920 may be fixed (i.e., non-adjustable), and/or some of the phaseshifters 1914, 1916 and/or attenuators 1918, 1920 may be excluded fromthe signal adjustment device 1910. Further, some embodiments may includeonly adjustable phase shifters (e.g., phase shifters 1914, 1916) or onlyadjustable attenuators (e.g., attenuators 1918, 1920), but not both.Further still, some embodiments may have the RF signal adjustmentcircuits coupled between the outputs of the amplifier stages 1940, 1942and the inputs to the combiner circuit 1950, instead of or in additionto being coupled to the inputs of the amplifier stages 1940, 1942.

According to an embodiment, each phase shifter 1914, 1916 may bedigitally controlled to apply one of a plurality of discrete phaseshifts to the signals along paths 1906, 1908, respectively. Similarly,each attenuator 1918, 1920 may be digitally controlled to apply one of aplurality of discrete attenuation levels to the signals along paths1906, 1908, respectively. More specifically, based on control signalsprovided by controller circuit 1922, the first and second adjustablephase shifters 1914, 1916 apply phase shifts to the signals conveyedalong the first and second amplification paths 1906, 1908. Similarly,based on control signals provided by controller circuit 1922, the firstand second adjustable attenuators 1918, 1920 attenuate the signalsconveyed along the first and second amplification paths 1906, 1908. Forexample, the first and second adjustable phase shifters 1914, 1916 mayinclude a configuration of switches (e.g., transistors) that may becontrolled to achieve a desired signal phase shift, and the controllercircuit 1922 may produce switch control signals that affect the statesof the switches. Similarly, the first and second adjustable attenuators1918, 1920 may include a configuration of switches (e.g., transistors)that may be controlled to achieve a desired attenuation level, and thecontroller circuit 1922 may produce switch control signals that affectthe states of the switches.

According to an embodiment, the controller circuit 1922 includes one ormore inputs for receiving signals from digital interface 1928. Morespecifically, the signals indicate the phase shifts and attenuations tobe applied by each of the adjustable phase shifters 1914, 1916 and theadjustable attenuators 1918, 1920 at any given time. Essentially, thecontroller circuit 1922 converts the signals from digital interface 1928into control signals (e.g., switch control signals) that are provided tothe adjustable phase shifters 1914, 1916 and adjustable attenuators1918, 1920.

The digital interface 1928 may include, for example a serial interface(e.g., a serial peripheral interface (SPI)) and/or a parallel interface.For example, the digital interface 1928 may include one or more inputsfor receiving phase shift and attenuation values for provision tocontroller circuit 1922. In addition, the digital interface 1928 mayinclude one or more mode control inputs for receiving control signals(e.g., from microcontroller 1960). According to yet another embodiment,the digital interface 1928 may include one or more inputs for receivingphase shift and attenuation values from a plurality of switches and/orfuses (not shown), which also may form a portion of the amplifier system1900. In addition to the above-described inputs, signal adjustmentdevice 1910 may include additional interfaces for receiving clocksignals, reset signals, power, ground, and so on.

Microcontroller 1960 may determine which phase shifts and attenuationsshould be applied by each of the adjustable phase shifters 1914, 1916based on one or more of a variety of operational conditions and/or othercriteria. For example, microcontroller 1960 may determine which phaseshifts and attenuations to indicate based on an evaluation of one ormore current operational conditions that are selected from atemperature, a power of the input RF signal (e.g., at input 1902), apower of the output RF signal (e.g., at output 1904), a signal frequency(e.g., the fundamental or center frequency of the input RF signal), biasvoltages applied to the amplifier stages 1940, 1942 (e.g., Vdd and/orVgs), or other conditions. According to an embodiment, a calibrationtable may be stored in memory 1962, which enables microcontroller 1960to determine which phase shifts and attenuations to select based on thecurrent operational conditions.

According to an embodiment, when microcontroller 1960 determines whichphase shifts and attenuations to indicate based on temperature, system1900 may include a temperature sensor 1932, which provides a signal tomicrocontroller 1960 that indicates a current temperature reading. Forexample, temperature sensor 1932 may be placed in proximity to or may beintegrated with amplifier device 1930. Alternatively, temperature sensor1932 may be located elsewhere. When microcontroller 1960 determineswhich phase shifts and attenuations to indicate based on input RF signalpower and/or output RF signal power, system 1900 may include powermeters 1952 and/or 1954 coupled to input 1902 and/or output 1904,respectively. The power meters 1952, 1954 each may sense the signalpower at the nodes to which they are coupled, and may providedindications of the signal power to microcontroller 1960.

Memory 1962 may include volatile memory (e.g., random access memory(RAM)) or non-volatile memory (e.g., read only memory (ROM) (includingprogrammable ROM (PROM), erasable PROM (EPROM), electrically erasablePROM (EEPROM)), flash memory, nonvolatile random access memory (NVRAM),and so on), in an embodiment.

According to a specific embodiment, phase shift and attenuation data maybe stored in a phase shift and attenuation lookup table (LUT) withinmemory 1962, where the LUT includes a plurality of addressable LUTentries. For example, the phase shift and attenuation data for the LUTmay be determined by external calibration equipment during a calibrationprocedure. In the illustrated embodiment, which includes two adjustablephase shifters 1914, 1916 and two adjustable attenuators 1918, 1920,each of the LUT entries may include first and second phase shift values,and first and second attenuation values.

Within amplifier device 1930, amplifier stages 1940, 1942 each areconfigured to amplify the RF signals provided at nodes 1919 and 1921,respectively, by the RF signal adjustment circuits. Although RFamplifier device 1930 is shown in simplified form in FIG. 19, RFamplifier device 1930 may have a more complicated configuration, such asthe configuration of RF amplifier device 1850 in FIG. 18. Morespecifically, each amplifier path of RF amplifier device 1930 mayinclude an input impedance matching circuit (e.g., input circuits 110,210, 310, 1810, 1812), one or more amplifier stages 1940, 1942 (e.g.,transistors 120, 420, 421, 1820, 1821), and an output impedance matchingcircuit (e.g., output circuits 130, 230, 330, 1830, 1832) coupled inseries between input terminals (e.g., conductive features 502, 503 ornodes 1802, 1803) and output terminals (e.g., conductive features 504,505 or nodes 1802, 1803) of the device 1930. In addition, each amplifierstage 1940, 1942 may be coupled to a voltage reference plane (e.g.,ground) through one or more terminals (e.g., conductive feature 506 orterminal 1806), and each amplifier stage 1940, 1942 also may be coupledto one or more bias voltages supplied by bias circuitry 1970 (e.g.,through conductive features 508, 509 and/or terminals 1808, 1809).

After amplification of the RF signals carried on the first and secondamplification paths 1906, 1908 by the amplifier stages 1940, 1942, theamplifier RF signals are combined by combiner circuit 1950. The combinercircuit 1950 is coupled between output terminals (not labeled) of theamplifier device 1930 and output terminal 1904, which may be coupled toa load (e.g., an antenna, not illustrated). Along with combining theamplified signals, combiner circuit 1950 also may apply a phase shift tothe signals carried along one or both of the amplification paths 1906,1908, for example, so that the signals carried along the twoamplification paths 1906, 1908 are summed in phase before being providedto the output terminal 1904.

According to an embodiment, the various components of device 1930 may beimplemented on a single integrated circuit chip, and device 1930 and theother components of system 1900 may be coupled to a common modulesubstrate (e.g., module substrate 2110, FIG. 21) to produce an amplifiermodule (e.g., amplifier module 2500, FIG. 25), as will be described indetail below. Alternatively, an amplifier module may include additionalor different components than those included in the amplifier system1900, as will be explained later.

FIG. 20 is a flowchart of a method of manufacturing an amplifier module(e.g., amplifier module 2500, FIG. 25) that includes an amplifier system(e.g., system 1800, 1900, FIGS. 18, 19, or another amplifier system), inaccordance with an example embodiment. For enhanced understanding, FIG.20 should be viewed in parallel with FIGS. 21-26, which illustratevarious views of an embodiment of an amplifier module in the process ofmanufacturing the amplifier module. According to an embodiment,manufacturing an amplifier module essentially includes coupling one ormore singulated die (e.g., die 450, FIG. 4) and other amplifier systemcomponents to a module substrate (e.g., module substrate 2110, FIG. 21),and the method also may include encapsulating the module substrate andcomponents.

Multiple amplifier modules may be produced in a parallel process,according to an embodiment, using a substrate that includes a matrix ofmodule substrates (e.g., matrix 2100, FIG. 21), a strip of modulesubstrates, or some other configuration of multiple module substrates.Alternatively, an amplifier module may be produced by coupling thedie(s) and other amplifier system components to a pre-singulated orotherwise separate and distinct module substrate. The flowchart of FIG.20 and the drawings in FIGS. 21-26 correspond to a matrix-orientedparallel manufacturing process. Those of skill in the art wouldunderstand how to modify the process to fabricate a single amplifiermodule or to fabricate multiple amplifier modules in parallel using adifferently-configured, multiple module substrate.

Referring also to FIGS. 21 and 22, which show a top view and a side,cross-sectional view (along line 22-22 of FIG. 21), respectively, of amatrix 2100 of module substrates 2110 (the boundaries of each beingindicated with dashed lines), manufacturing an amplifier module maybegin, in block 2002 by forming a plurality of conductive interconnectstructures 2120-2130 on and/or within each module substrate 2110 of thematrix 2100. For example, the module substrate 2110 may include aprinted circuit board (PCB) 2140, which includes one or more dielectricmaterial layers 2142 (e.g., FR-4 or other PCB dielectrics) and one ormore conductive layers 2144, 2146. The module substrate 2110 has a topmodule substrate surface 2148 to which some of the conductiveinterconnect structures (e.g., structures 2121-2127) are coupled, and abottom module substrate surface 2149 to which others of the conductiveinterconnect structures (e.g., structures 2221, 2222) are coupled. Otherones of the conductive interconnect structures (e.g., structures 2130,2231, 2232) extend through the dielectric material layer(s) 2142 betweenthe top and bottom module substrate surfaces 2148, 2149. Although onlyone dielectric material layer 2142 and two conductive layers 2144, 2146are shown in FIG. 22, the PCB 2140 may include more than one dielectricmaterial layer, and/or more than two conductive layers. Further, inother embodiments, module substrate 2110 may be a type of substrateother than a PCB. Further still, although a particular number,arrangement, and configuration of conductive interconnect structures2121-2130, 2221, 2222, 2231, 2232 are illustrated, the number,arrangement, and/or configuration of conductive interconnect structurescould be modified in a variety ways, depending on the components of themodule being constructed. The illustrated number, arrangement, andconfiguration of conductive interconnect structures is for purpose ofexample, and not of limitation.

The plurality of conductive interconnect structures may include aplurality of first conductive interconnect structures 2121-2129 coupledto the top module substrate surface 2148, a plurality of secondconductive interconnect structures 2221, 2222 coupled to the bottommodule substrate surface 2149, a bulk conductive structure 2130extending between the top and bottom module surfaces 2148, 2149 (e.g.,formed or inserted within an opening through the dielectric layer(s)2142), and a plurality of through substrate vias (TSVs) 2231, 2232, alsoextending between the top and bottom module surfaces 2148, 2149. In analternate embodiment, some or all of the TSVs 2231, 2232 could bereplaced with wrap-around terminations or other conductive structures.For example, the bulk conductive structure 2130 may be a conductivestructure (e.g., a conductive (e.g., copper) coin or other structure)that is press-fit or otherwise coupled within an opening through the PCB2140. The bulk conductive structure 2130 may function both as a heatsink, and as a connection to a voltage reference (e.g., ground), whenthe bulk conductive structure 2130 is coupled to the voltage reference.

According to an embodiment, the plurality of first conductiveinterconnect structures 2121-2129 may be formed by patterning theconductive layer 2144 coupled to the top module surface 2148, and theplurality of second conductive interconnect structures 2221, 2222 may beformed by patterning the conductive layer 2146 coupled to the bottommodule surface 2149. As can be seen in both FIGS. 21 and 22, theplurality of first conductive interconnect structures 2121-2129 onlypartially cover the top module substrate surface 2148 to define aplurality of conductor-less areas (e.g., areas 2250, 2252, among others)at the top module substrate surface 2148.

Referring again to FIG. 20, the various components of the amplifiermodule are formed, in block 2004. The various components may be formedbefore, contemporaneously with, or after block 2002. According to anembodiment, forming the various components includes forming an amplifierdie (e.g., die 450, 2350, FIGS. 4, 23, also referred to as an “amplifierdevice”), which includes a semiconductor substrate (e.g., substrate 650,FIG. 6) having a top semiconductor substrate surface and a bottomsemiconductor substrate surface (e.g., surfaces 652, 654, FIG. 6), atleast one conductive feature (e.g., features 502-506, 508, 509, 2402,2404, 2406, FIGS. 5, 24) coupled to the bottom semiconductor substratesurface, at least one transistor (e.g., transistor 420, 421, FIG. 4)formed at the top semiconductor surface, and at least one circuit (e.g.,filter circuits 110, 130, 210, 230, 310, 330, FIGS. 1-3) electricallycoupled to the transistor(s). As discussed previously in detail inconjunction with FIG. 5, the conductive feature(s) coupled to the bottomsemiconductor substrate surface only partially cover the bottomsemiconductor substrate surface to define one or more conductor-lessregions (e.g., regions 580, 582, 584, 586, 2480, 2482, FIGS. 5, 24) thatspan portions of the bottom semiconductor substrate surface. Further, atleast one of the filter circuits includes a passive component (e.g.,inductor 416, 417, 434, 435, 2416, 2434, FIGS. 4, 24) formed over aportion of the top semiconductor substrate surface that is directlyopposite one of the conductor-less regions. Although the amplifier diepreviously described (e.g., amplifier die 450) may be used in theamplifier module, it should be understood that other die having otherconfigurations alternatively may be used.

In addition to forming the amplifier die (e.g., die 450, 2350, FIGS. 4,23), formation of the amplifier module components also may include, forexample, forming a component for performing analog pre-distortion 2310(e.g., embodying the circuitry of modifiable signal adjustment device1910, FIG. 19), forming a component for performing digitalpre-distortion, forming a controller or other processing component(e.g., embodying micro controller 1960), forming a bias circuitry moduleor components 2370 (e.g., embodying bias circuitry 1970, FIG. 19),forming a memory device (e.g., embodying memory 1962, FIG. 19), and/orforming additional or different components (e.g., temperature sensors(e.g., sensor 1932, FIG. 19), power meters (e.g., power meters 1952,1954, FIG. 4), power splitters (e.g., splitter 1912), power combiners2390 (e.g., combiner 1950, FIG. 19), phase shift components, otherdiscrete passive or active components 2380 (e.g., components 146, 244,346, FIGS. 1-3), connectors, and so on) that are to be included withinthe amplifier module.

Referring again to FIG. 20 and also to FIGS. 23 and 24, which show a topview and a side, cross-sectional view (along line 24-24 of FIG. 23),respectively, of a matrix 2100 of module substrates 2110 at a subsequentstage of manufacturing, the amplifier die 2350 and other systemcomponents (e.g., components 2310, 2370, 2380, 2390) are electricallyand mechanically coupled to the module substrate 2110, in block 2006. Toelectrically and mechanically couple the die 2350 and other systemcomponents to the module substrate 2110, conductive features (e.g.,features 2402, 2404, 2406) of the die 2350, and conductive features(including leads) of the other system components may be soldered orotherwise coupled to corresponding conductive interconnect structures2121-2129 at the top module surface 2148. In some cases, electricallycoupling conductive features of the various components provides forelectrical connection of the components to the bottom module substratesurface 2149 (e.g., component 2310 is electrically coupled to the bottommodule substrate surface 2149 through conductive features 2120, 2231,and 2221, and die 2350 is electrically coupled to the bottom modulesubstrate surface 2149 through conductive features 2406 and 2130).

According to an embodiment, one or more of the conductor-less regions2480, 2482 of the semiconductor die 2350 are aligned with one or more ofthe conductor-less areas 2250, 2252 at the top module substrate surface2148. Accordingly, as can be seen in FIG. 24, the vertical distance 2452between components 2416, 2434 and any underlying voltage reference plane(not shown, but for example coupled to the bottom module substratesurface 2149) is substantially greater than the distance 2450 betweenthe components 2416, 2434 and the top module substrate surface 2148. Forexample, the distance 2452 to the bottom module substrate surface 2149may be in a range of about 5 mils to about 50 mils or more, depending onthe cumulative thickness of the die 2350, conductive interconnectfeatures 2402, 2404, 2122, 2124, and the module substrate 2140, wheremost of the thickness is contributed by the module substrate 2140.Conversely, distance 2450 more typically may be in a range of about 50microns (2 mils) to about 100 microns (4 mils). The lack of a continuousvoltage reference plane coupled to the bottom surface of die 2350 (i.e.,the inclusion of conductor-less regions under “floating” inductors 2416,2434, according to the various embodiments), coupled with the lack of acontinuous voltage reference plane at to the top surface of modulesubstrate 2110 may achieve one or more of multiple advantages, includingsignificantly increasing the Q of inductors 2416, 2434 (or other passivecomponents overlying the conductor-less regions), among otheradvantages.

Referring again to FIG. 20 and also to FIGS. 25 and 26, which show a topview and a side, cross-sectional view (along line 26-26 of FIG. 25),respectively, of a matrix 2100 of module substrates 2110 at a subsequentstage of manufacturing, encapsulant material 2590 (e.g., plasticencapsulant) may be applied over the amplifier die 2350, the othersystem components, and the top module substrate surface 2148, althoughthe encapsulant material 2590 may be excluded, in other embodiments.

In block 2010, the module matrix 2100 is diced along saw streets(indicated with dashed lines in FIG. 25), to singulate the individualamplifier modules 2110 from the module matrix 2100. At this point, eachmodule 2110 may be considered to be packaged product, which may bedirectly coupled (e.g., soldered), in block 2012, to another PCB orother substrate (not illustrated) that includes other portions of theelectrical system within which amplifier module 2110 is to beincorporated. For example, conductive interconnect structures 2221, 2222may be soldered to another PCB or other substrate to electricallyconnect the module components to other portions of the externalelectrical system. In various embodiments, a module 2110 may include aland grid array, a ball grid array, edge wrap-around connections, orvarious other types of interconnect structures for electricallyconnecting the module components to the external electrical system.

Although FIGS. 19-26 correspond to incorporation of a semiconductor die(e.g., semiconductor die 450, 2350, FIGS. 4, 23) into a fairly complexamplifier system (e.g., amplifier system 1900, FIG. 19) to produce anamplifier module (e.g., amplifier module 2100, FIG. 26), a semiconductordie (e.g., semiconductor die 450, 2350, FIGS. 4, 23) may be incorporatedinto differently configured amplifier systems to produce alternativeamplifier modules, as well. For example, a semiconductor die (e.g.,semiconductor die 450, 2350, FIGS. 4, 23) may be incorporated into asimpler Doherty amplifier system (e.g., Doherty amplifier 1800, FIG. 18)by directly coupling the semiconductor die to a module substrate thatincludes only a power splitter (e.g., power splitter 1840), a powercombiner (e.g., power combiner 1860) and other components, andoptionally applying encapsulant over the module substrate surface towhich the semiconductor die, the power splitter, and the power combinerare coupled. Similarly, a semiconductor die (e.g., semiconductor die450, 2350, FIGS. 4, 23) could be coupled to module substrates thatinclude conductive interconnect structures and other components thatcorrespond to differently configured amplifiers. Accordingly, it shouldbe understood that the scope of the inventive subject matter is notlimited to any particular type of amplifier system.

Although many of the embodiments discussed herein include amplifierdevices and systems with two parallel amplifier paths (e.g., a mainamplifier path and a peaking amplifier path), other embodiments mayinclude amplifier devices and systems with a single amplifier path, oramplifier devices and systems with more than two parallel amplifierpaths (e.g., a main amplifier stage and two or more peaking amplifierstages, with each peaking amplifier stage being biased at a differentclass-C operating point). In addition, although embodiments of Dohertyamplifier topologies are discussed in detail herein, those of skill inthe art would understand, based on the description herein, that theembodiments may be implemented in amplifiers having topologies otherthan Doherty amplifier topologies.

An embodiment of an amplifier module includes a module substrate, aplurality of conductive interconnect structures coupled to the topmodule substrate surface, and an amplifier device coupled to the modulesubstrate top surface. The conductive interconnect structures onlypartially cover the top module substrate surface to define a pluralityof conductor-less areas at the top module substrate surface. Theamplifier device includes a semiconductor substrate, a transistor, aconductive feature coupled to the bottom semiconductor substrate surfaceand to at least one of the conductive interconnect structures, and afilter circuit electrically coupled to the transistor. The conductivefeature only partially covers the bottom semiconductor substrate surfaceto define a conductor-less region that spans a portion of the bottomsemiconductor substrate surface. The conductor-less region is alignedwith at least one of the plurality of conductor-less areas at the topmodule substrate surface. The filter circuit includes a passivecomponent formed over a portion of the top semiconductor substratesurface that is directly opposite the conductor-less region.

An embodiment of a method of forming an amplifier module includescoupling a plurality of conductive interconnect structures to a topmodule substrate surface of a module substrate, and coupling anamplifier device to the module substrate top surface. The conductiveinterconnect structures only partially cover the top module substratesurface to define a plurality of conductor-less areas at the top modulesubstrate surface. The amplifier device includes a semiconductorsubstrate, a transistor, a conductive feature coupled to the bottomsemiconductor substrate surface and to at least one of the conductiveinterconnect structures, and a filter circuit electrically coupled tothe transistor. The conductive feature only partially covers the bottomsemiconductor substrate surface to define a conductor-less region thatspans a portion of the bottom semiconductor substrate surface. Theconductor-less region is aligned with at least one of the plurality ofconductor-less areas at the top module substrate surface. The filtercircuit includes a passive component formed over a portion of the topsemiconductor substrate surface that is directly opposite theconductor-less region.

The preceding detailed description is merely illustrative in nature andis not intended to limit the embodiments of the subject matter or theapplication and uses of such embodiments. As used herein, the word“exemplary” means “serving as an example, instance, or illustration.”Any implementation described herein as exemplary is not necessarily tobe construed as preferred or advantageous over other implementations.Furthermore, there is no intention to be bound by any expressed orimplied theory presented in the preceding technical field, background,or detailed description.

The connecting lines shown in the various figures contained herein areintended to represent exemplary functional relationships and/or physicalcouplings between the various elements. It should be noted that manyalternative or additional functional relationships or physicalconnections may be present in an embodiment of the subject matter. Inaddition, certain terminology may also be used herein for the purpose ofreference only, and thus are not intended to be limiting, and the terms“first”, “second” and other such numerical terms referring to structuresdo not imply a sequence or order unless clearly indicated by thecontext.

As used herein, a “node” means any internal or external reference point,connection point, junction, signal line, conductive element, or thelike, at which a given signal, logic level, voltage, data pattern,current, or quantity is present. Furthermore, two or more nodes may berealized by one physical element (and two or more signals can bemultiplexed, modulated, or otherwise distinguished even though receivedor output at a common node).

The foregoing description refers to elements or nodes or features being“connected” or “coupled” together. As used herein, unless expresslystated otherwise, “connected” means that one element is directly joinedto (or directly communicates with) another element, and not necessarilymechanically. Likewise, unless expressly stated otherwise, “coupled”means that one element is directly or indirectly joined to (or directlyor indirectly communicates with, electrically or otherwise) anotherelement, and not necessarily mechanically. Thus, although the schematicshown in the figures depict one exemplary arrangement of elements,additional intervening elements, devices, features, or components may bepresent in an embodiment of the depicted subject matter.

While at least one exemplary embodiment has been presented in theforegoing detailed description, it should be appreciated that a vastnumber of variations exist. It should also be appreciated that theexemplary embodiment or embodiments described herein are not intended tolimit the scope, applicability, or configuration of the claimed subjectmatter in any way. Rather, the foregoing detailed description willprovide those skilled in the art with a convenient road map forimplementing the described embodiment or embodiments. It should beunderstood that various changes can be made in the function andarrangement of elements without departing from the scope defined by theclaims, which includes known equivalents and foreseeable equivalents atthe time of filing this patent application.

What is claimed is:
 1. An amplifier module comprising: a modulesubstrate having a top module substrate surface and a bottom modulesubstrate surface; a plurality of first conductive interconnectstructures coupled to the top module substrate surface, wherein theplurality of first conductive interconnect structures only partiallycover the top module substrate surface to define a plurality ofconductor-less areas at the top module substrate surface; and anamplifier device coupled to the module substrate top surface, whereinthe amplifier device includes: a semiconductor substrate having a topsemiconductor substrate surface and a bottom semiconductor substratesurface, a transistor, a first conductive feature coupled to the bottomsemiconductor substrate surface and to at least one of the firstconductive interconnect structures, wherein the first conductive featureonly partially covers the bottom semiconductor substrate surface todefine a first conductor-less region that spans a first portion of thebottom semiconductor substrate surface, and wherein the firstconductor-less region is aligned with at least one of the plurality ofconductor-less areas at the top module substrate surface, and a firstfilter circuit electrically coupled to the transistor, wherein the firstfilter circuit includes a first passive component formed over a portionof the top semiconductor substrate surface that is directly opposite thefirst conductor-less region.
 2. The amplifier module of claim 1, furthercomprising one or more additional amplifier system components coupled tothe module substrate top surface and electrically coupled to theamplifier device, wherein the one or more additional amplifier systemcomponents are selected from a power splitter, a power combiner, a phaseshifter, an attenuator, a module for digitally controlling phase shift,a module for digitally controlling attenuation, a controller, a biascircuit, a memory device, a power meter, and a temperature sensor. 3.The amplifier module of claim 1, further comprising: a plurality ofsecond conductive interconnect structures coupled to the bottom modulesubstrate surface; and a plurality of third conductive interconnectstructures coupled between the first conductive interconnect structuresand the second conductive interconnect structures, wherein each of thethird conductive interconnect structures is selected from a throughsubstrate via (TSV) and a wrap-around termination.
 4. The amplifiermodule of claim 1, further comprising: encapsulant applied over the topsemiconductor substrate surface and over the top module substratesurface.
 5. The amplifier module of claim 1, further comprising: a bulkconductive structure in the module substrate, extending between the topmodule substrate surface and the bottom module substrate surface, andcoupled to the first conductive feature.
 6. The amplifier module ofclaim 1, wherein the first passive component is a spiral inductorcomprising portions of one or more conductive layers formed over the topsemiconductor substrate surface.
 7. The amplifier module of claim 1,wherein the first filter circuit is selected from a low pass filtercircuit, a high pass filter circuit, and a band pass filter circuit. 8.The amplifier module of claim 1, wherein: the transistor includes afirst control terminal, a first current conducting terminal, and asecond current conducting terminal; the first current conductingterminal is electrically coupled to the first conductive feature; thefirst filter circuit is electrically coupled to the second currentconducting terminal; and the amplifier module further comprises: asecond conductive feature coupled to the bottom semiconductor substratesurface, wherein the second conductive feature is physically separatedfrom the first conductive feature across the first conductor-lessregion, and wherein the second current conducting terminal iselectrically coupled to the second conductive feature and to at leastone of the first conductive interconnect structures.
 9. The amplifiermodule of claim 8, wherein the semiconductor substrate is a highresistivity substrate, and the second current conducting terminal iselectrically coupled to the second conductive feature with at least oneconductive structure selected from a through substrate via (TSV) and awrap-around termination.
 10. The amplifier module of claim 8, wherein:the first passive component is a first inductor with first and secondinductor terminals, the first inductor terminal is electrically coupledto the second current conducting terminal and to the second conductivefeature, the first filter circuit further includes a capacitor withfirst and second capacitor plates, the first capacitor plate iselectrically coupled to the second inductor terminal at a radiofrequency (RF) cold point node, and the second capacitor plate iselectrically coupled to the first conductive feature.
 11. The amplifiermodule of claim 8, further comprising: a third conductive feature thatis physically separated from the first conductive feature across asecond conductor-less region spanning a second portion of the bottomsemiconductor substrate surface; and a second filter circuitelectrically coupled to the first control terminal and to the thirdconductive feature.
 12. The amplifier module of claim 11, wherein thesecond filter circuit includes a second passive component formed over aportion of the top semiconductor substrate surface is directly oppositethe second conductor-less region.
 13. The amplifier module of claim 11,wherein: the module substrate comprises a printed circuit board; and theplurality of conductive interconnect structures includes a firstconductive trace coupled to the top module substrate surface and to thesecond conductive feature, and a second conductive trace coupled to thetop module substrate surface and to the third conductive feature. 14.The amplifier module of claim 11, wherein the second filter circuit isselected from a low pass filter circuit, a high pass filter circuit, anda band pass filter circuit.
 15. The amplifier module of claim 8,wherein: the first current conducting terminal is electrically coupledto the first conductive feature through at least one first TSV thatextends between the top and bottom semiconductor substrate surfaces, andthe second current conducting terminal is electrically coupled to thesecond conductive feature through at least one second TSV that extendsbetween the top and bottom semiconductor substrate surfaces.
 16. Theamplifier module of claim 8, wherein: the first and second conductivefeatures form portions of a patterned conductive layer coupled to thebottom semiconductor substrate surface, and the patterned conductivelayer has a thickness in a range of 10 microns to 50 microns.
 17. Amethod of forming an amplifier module, the method comprising the stepsof: coupling a plurality of first conductive interconnect structures toa top module substrate surface of a module substrate, wherein theplurality of first conductive interconnect structures only partiallycover the top module substrate surface to define a plurality ofconductor-less areas at the top module substrate surface; and couplingan amplifier device to the module substrate top surface, wherein theamplifier device includes: a semiconductor substrate having a topsemiconductor substrate surface and a bottom semiconductor substratesurface, a first conductive feature coupled to the bottom semiconductorsubstrate surface and to at least one of the first conductiveinterconnect structures, wherein the first conductive feature onlypartially covers the bottom semiconductor substrate surface to define afirst conductor-less region that spans a first portion of the bottomsemiconductor substrate surface, and wherein the first conductor-lessregion is aligned with at least one of the plurality of conductor-lessareas at the top module substrate surface, a transistor formed at thetop semiconductor substrate surface, and a first filter circuitelectrically coupled to the second current conducting terminal, whereinthe first filter circuit includes a first passive component formed overa portion of the top semiconductor substrate surface that is directlyopposite the first conductor-less region.
 18. The method of claim 17,further comprising: coupling one or more additional amplifier systemcomponents to the module substrate top surface, wherein the one or moreadditional amplifier system components are electrically coupled to theamplifier device, and wherein the one or more additional amplifiersystem components are selected from a power splitter, a power combiner,a phase shifter, an attenuator, a module for digitally controlling phaseshift, a module for digitally controlling attenuation, a controller, abias circuit, a memory device, a power meter, and a temperature sensor.19. The method of claim 17, further comprising: applying encapsulantover the top semiconductor substrate surface and over the top modulesubstrate surface.
 20. The method of claim 19, wherein: the modulesubstrate comprises a first portion of a multiple-module printed circuitboard that includes a plurality of additional module substrates; and themethod further comprises: coupling a plurality of additional amplifierdevices to the plurality of additional module substrates; applyingencapsulant over the top module substrate surfaces of the modulesubstrate and the additional module substrates; and performing asingulation process to form the amplifier module and a plurality ofadditional amplifier modules.